1/7/2021 | 85429000 | SHG17AA00002 # & Chips semiconductor technology used in manufacturing semiconductor chips (Wafer), SHG17AA00002 | 702800 | PCE | 7028 | South Korea | HA NOI | Công ty TNHH WISOL Hà Nội | Get Detailed Shipment Records
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1/7/2021 | 85429000 | SWG42ESB0H01 # & Chips semiconductor technology used in manufacturing semiconductor chips (WAFER (FAB)), kt: 0.66 * 0.1 * 2mm; SWG42ESB0H01 | 195932 | PCE | 1959.32 | South Korea | HA NOI | Công ty TNHH WISOL Hà Nội |
1/7/2021 | 85429000 | SHG42AA00001 # & Chips semiconductor technology used in manufacturing semiconductor chips (Wafer); SHG42AA00001 | 232390 | PCE | 2323.9 | South Korea | HA NOI | Công ty TNHH WISOL Hà Nội |
1/7/2021 | 85429000 | SH780AKS0H01 # & Chips semiconductor technology used in manufacturing semiconductor chips (WAFER (FAB)), 350um thick (+ -) 10um; SH780AKS0H01 | 349284 | PCE | 15717.78 | South Korea | HA NOI | Công ty TNHH WISOL Hà Nội |
1/7/2021 | 85429000 | SR881ASC0H01 # & Chips semiconductor technology used in manufacturing semiconductor chips (WAFER (FAB)), 1.2 * 0.76 * 2mm; SR881ASC0H01 | 567375 | PCE | 8510.625 | South Korea | HA NOI | Công ty TNHH WISOL Hà Nội |
1/7/2021 | 85429000 | SH942CA40001 # & Chips semiconductor technology used in manufacturing semiconductor chips (Wafer), SH942CA40001 | 544992 | PCE | 5449.92 | South Korea | HA NOI | Công ty TNHH WISOL Hà Nội |
1/7/2021 | 85429000 | SH806BA00001 # & Chips semiconductor technology used in manufacturing semiconductor chips (WAFER (FAB)); SH806BA00001 | 287070 | PCE | 2870.7 | South Korea | HA NOI | Công ty TNHH WISOL Hà Nội |
1/7/2021 | 85429000 | SWG42ESB0H01 # & Chips semiconductor technology used in manufacturing semiconductor chips (WAFER (FAB)), kt: 0.66 * 0.1 * 2mm; SWG42ESB0H01 | 8906 | PCE | 89.06 | South Korea | HA NOI | Công ty TNHH WISOL Hà Nội |
1/7/2021 | 85429000 | SRG45AQF0001 # & Chips semiconductor technology used in manufacturing semiconductor chips (Wafer); SRG45AQF0001 | 210240 | PCE | 6517.44 | South Korea | HA NOI | Công ty TNHH WISOL Hà Nội |
1/7/2021 | 85429000 | SRG00BP70H01 # & Chips semiconductor technology used in manufacturing semiconductor chips (WAFER (FAB)), 350um thick (+ -) 10um; SRG00BP70H01 | 23157 | PCE | 1042.065 | South Korea | HA NOI | Công ty TNHH WISOL Hà Nội |