1/18/2021 | 38249999 | Thermal conductivity silicon glue to the bridge rectifier, IGBT modules and chassis parts, NSX: TA LI, q.cach: TLZ-200,2.5Kg / barrel, the main tp: Polydimethylsiloxane10-20% Zinc oxide 35-50% ; alumin35-50% silica 0.1-2% .Each 100% | 24 | KGM | 228.24 | China | LANG SON LANG SON | CôNG TY TNHH Kỹ THUậT Tự ĐộNG HóA LIHUA VIệT NAM | Get Detailed Shipment Records
|
1/26/2021 | 38249999 | Thermal conductivity silicon glue to the bridge rectifier, IGBT modules and chassis parts, NSX: TA LI, q.cach: TLZ-200, 2.5kg / barrel, tp: Polydimethylsiloxane10-20% Zinc oxit35-50%; alumin35-50% silica 0.1-2%, 100% | 24 | KGM | 228.24 | China | LANG SON LANG SON | CôNG TY TNHH Kỹ THUậT Tự ĐộNG HóA LIHUA VIệT NAM |
1/4/2021 | 38249999 | Thermal conductivity silicon glue to the bridge rectifier, IGBT modules and chassis parts, NSX: TA LI specifications: TLZ-200,2.5Kg / barrel, tp: Polydimethylsiloxane10-20%; Oxit35-50% zinc; alumin35-50% silica 0.1-2% .Each 100% | 24 | KGM | 228.24 | China | LANG SON LANG SON | CôNG TY TNHH Kỹ THUậT Tự ĐộNG HóA LIHUA VIệT NAM |
1/12/2021 | 38249999 | Thermal conductivity silicon glue to the bridge rectifier, IGBT modules and chassis parts, NSX: TA LI, q.cach: TLZ-200,2.5Kg / barrel, the main tp: Polydimethylsiloxane10-20%; Oxit35-50% zinc, alumina 35-50% silica 0.1-2%. New 100% | 24 | KGM | 228.24 | China | LANG SON LANG SON | CôNG TY TNHH Kỹ THUậT Tự ĐộNG HóA LIHUA VIệT NAM |