3/28/2024 | 35069900 | 5CHJ00444A#&Components adhesive (SA2221DN), ingredients include: Bisphenol F type epoxy resin(liquid),Synthetic Resins, Silica (amorphous), Polymerization initiators. (1pcs=30g=30cc). 100% New | CONG TY TNHH RESTAR ELECTRONICS VIET NAM | 1500 | GRM | 12120 | Japan | NA |
3/28/2024 | 35069900 | 5CHJ00437A#&Components adhesive (SA2220DN-X) for AV24 OVB (NPI), including: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Silica (amorphous), Polymerization initiators. 100% new | CONG TY TNHH RESTAR ELECTRONICS VIET NAM | 900 | GRM | 7074 | Japan | NA |
3/28/2024 | 35069900 | 5CHJ00368A#&Components adhesive (SA2203DN), ingredients include: Bisphenol F type epoxy resin(liquid),Synthetic Resins, Bisphenol A type Epoxy Resin,Polymerization initiators.(1pcs=50g=50cc).. 100% new product | CONG TY TNHH RESTAR ELECTRONICS VIET NAM | 8750 | GRM | 63612.5 | Japan | NA |
3/27/2024 | 35069900 | Component glue (SA2201DN), ingredients include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1PCS= 30CC). New 100% | RESTAR ELECTRONICS KOREA CORPORATION | 100 | PCE | 10146 | Japan | NA |
3/27/2024 | 35069900 | Component glue (SA2203DN), ingredients include: Bisphenol F type epoxy resin(liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Polymerization initiators.(1pcs=70g=70cc). 100% New | RESTAR ELECTRONICS KOREA CORPORATION | 450 | PCE | 211383 | Japan | NA |
3/27/2024 | 35069900 | Component glue (SA2221DN), ingredients include: Bisphenol F type epoxy resin(liquid), Synthetic Resins, Silica (amorphous), Polymerization initiators. (1pcs=30g=30cc) 100% new product | RESTAR ELECTRONICS KOREA CORPORATION | 100 | PCE | 23073 | Japan | NA |
3/27/2024 | 35069900 | Component glue (SA2203DN), ingredients include: Bisphenol F type epoxy resin(liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Polymerization initiators.(1pcs=70g=70cc). 100% New | RESTAR ELECTRONICS KOREA CORPORATION | 100 | PCE | 46974 | Japan | NA |
3/27/2024 | 35069900 | ABS-0142#&ABS-0142 liquid adhesive, TP: Acrylic ester co-polymer 35+-1%,ETHYL ACETATE 53-57%,ACETONE 2-5%,METHANOL 6-9%, 100% new | ANYONE CO.,LTD. | 720 | KGM | 3327.624 | South Korea | NA |
3/26/2024 | 35069900 | 5CHJ00466A# & Component glue (SA2203DN) includes: BisphenolF type epoxy resin(liquid),Synthetic Resins,BisphenolA typeEpoxy Resin,Polymerization initiators(1pcs=70g=70cc).100% new | CONG TY TNHH RESTAR ELECTRONICS VIET NAM | 45500 | GRM | 323655.15 | Japan | NA |
3/26/2024 | 35069900 | 5CHJ00306A#&Components adhesive (SA2202DN), ingredients include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. 100% new. | CONG TY TNHH RESTAR ELECTRONICS VIET NAM | 750 | GRM | 3936 | Japan | NA |