1/27/2021 | 84799030 | Q310-848528 # & semi-finished parts support of the screen, used in the paste screen mobile phones, Model: WINDOW eCRM AMB667UM06_LAMI_ JIG BASE # & VN | 15 | PCE | 4241.896889 | Vietnam | CONG JS HITECH VINA CO LTD | JS Hitech Vina Company Limited | Get Detailed Shipment Records
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1/27/2021 | 84799030 | Q310-885591 # & Parts electronic circuit mounted on the phone screen, under the bonding paste machine, steel material, the model AMB136ZH04_OLB_COP BONDING HEAD PRE TIP_V2-3F_SKD # & VN | 1 | PCE | 121.818577 | Vietnam | CONG JS HITECH VINA CO LTD | JS Hitech Vina Company Limited |
1/27/2021 | 84799030 | Q310-877914 # & Parts electronic circuit mounted on the phone screen, under the bonding paste machine, steel material, the model AMB623ZF01_OLB_COP MAIN BONDING HEAD TIP_SKD11_R1 # & VN | 2 | PCE | 104.415923 | Vietnam | CONG JS HITECH VINA CO LTD | JS Hitech Vina Company Limited |
1/27/2021 | 84799030 | Q310-877923 # & Parts electronic circuit mounted on the phone screen, under the bonding paste machine, steel material, the model AMB623ZF01_OLB_FOP BONDING HEAD PRE TIP_SKD11_R1 # & VN | 1 | PCE | 82.662606 | Vietnam | CONG JS HITECH VINA CO LTD | JS Hitech Vina Company Limited |
1/27/2021 | 84799030 | Q310-877912 # & Parts electronic circuit mounted on the phone screen, under the bonding paste machine, steel material, the model AMB623ZF01_OLB_MAIN BACKUP COP_R1 # & VN | 2 | PCE | 217.533174 | Vietnam | CONG JS HITECH VINA CO LTD | JS Hitech Vina Company Limited |
1/27/2021 | 84799030 | Q310-877911 # & Parts electronic circuit mounted on the phone screen, under the bonding paste machine, steel material, the model AMB623ZF01_OLB_MAIN BACKUP FOP_R1 # & VN | 2 | PCE | 217.533174 | Vietnam | CONG JS HITECH VINA CO LTD | JS Hitech Vina Company Limited |
1/27/2021 | 84799030 | Q310-885351 # & Parts electronic circuit mounted on the phone screen, under the bonding paste machine, steel material, the model AMB136ZH01_OLB_COP MAIN BONDING HEAD TIP_V2-3F_SKD # & VN | 2 | PCE | 243.637155 | Vietnam | CONG JS HITECH VINA CO LTD | JS Hitech Vina Company Limited |
1/27/2021 | 84799030 | Q310-878839 # & Parts electronic circuit mounted on the phone screen, under the bonding paste machine, steel material, the model AMB568YH01_OLB_COP BONDING HEAD PRE TIP_SKD_R1_JAS # & VN | 1 | PCE | 82.662606 | Vietnam | CONG JS HITECH VINA CO LTD | JS Hitech Vina Company Limited |
1/27/2021 | 84799030 | Q310-878582 # & Parts electronic circuit mounted on the phone screen, under the bonding paste machine, steel material, the model AMB656YG08_OLB_COP BONDING HEAD PRE TIP_R1_SKD_JAS # & VN | 1 | PCE | 82.662606 | Vietnam | CONG JS HITECH VINA CO LTD | JS Hitech Vina Company Limited |
1/27/2021 | 84799030 | Q310-878872 # & Parts electronic circuit mounted on the phone screen, under the bonding paste machine, steel material, the model AMB656YG08_OLB_FOP BONDING HEAD PRE TIP_SKD11_R1 # & VN | 1 | PCE | 82.662606 | Vietnam | CONG JS HITECH VINA CO LTD | JS Hitech Vina Company Limited |