1/17/2022 | 3910000090 | 1. Silicone paste (alcohol-free) with high thermal conductivity, designed to remove and redistribute heat from the microprocessor to the cooling radiator, is applied to the microprocessor before installing the radiator, not in aerosol packaging: ar | 0 | kg | 19 | Ukraine | UA100150 | Dell c/o UPS SCS | Get Detailed Shipment Records
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1/24/2022 | 3910000090 | 1. Silicone paste (alcohol-free) with high thermal conductivity, designed to remove and redistribute heat from the microprocessor to the cooling radiator, is applied to the microprocessor before installing the radiator, not in aerosol packaging: ar | 0 | kg | 15 | Ukraine | UA100150 | Dell c/o UPS SCS |
1/4/2022 | 3910000090 | 1. Silicone paste (alcohol-free) with high thermal conductivity, designed to remove and redistribute heat from the microprocessor to the cooling radiator, is applied to the microprocessor before installing the radiator, not in aerosol packaging: ar | 0 | kg | 21 | Ukraine | UA100150 | Dell c/o UPS SCS |