11/24/2023 | 39094010000 | MOLDING COMPOUND SUMIKON RESIN TABLET MCC-G7001685 EME-G700L TYPE S 16MMX6.5G 150 KGS | SUMITOMO BAKELITE SINGAPORE PTE LTD | 0 | NA | 3908.8 | SINGAPORE | N/A |
11/24/2023 | 39094010000 | MOLD COMPOUND SUMIKON RESIN TABLET MCC-E670J1665-Q EME-E670J TYPE 16MMX6.5G 30 KGS | SUMITOMO BAKELITE SINGAPORE PTE LTD | 0 | NA | 3642.98 | SINGAPORE | N/A |
11/24/2023 | 39094010000 | MOLD COMPOUND SUMIKON RESIN TABLET MCC-E670J1665-Q EME-E670J TYPE 16MMX6.5G 60 KGS | SUMITOMO BAKELITE SINGAPORE PTE LTD | 0 | NA | 7285.95 | SINGAPORE | N/A |
11/23/2023 | 39094010000 | EPOXY MOLDING COMPOUND | HYSOL HUAWEI ELECTRONICS CO LT | 0 | NA | 1397.83 | CHINA | N/A |
11/16/2023 | 39094010000 | MOLDING COMPOUND SUMIKON RESIN TABLET | SUMITOMO BAKELITE SINGAPORE PTE LTD | 0 | NA | 101071.58 | SINGAPORE | N/A |
11/15/2023 | 39094010000 | MOLDING COMPOUND SUMIKON RESIN TABLET | SUMITOMO BAKELITE SINGAPORE PTELTD | 0 | NA | 177994.39 | SINGAPORE | N/A |
11/6/2023 | 39094010000 | MOLDING COMPOUND SUMIKON RESIN TABLET MCB- 722N43 EME-G700H TYPE C 14MMX6.4G | SUMITOMO BAKELITE SINGAPORE PTE LTD | 0 | NA | 35241.44 | SINGAPORE | N/A |
11/6/2023 | 39094010000 | MOLDING COMPOUND SUMIKON RESIN TABLET MCB-721N42-Q EME-E670 TYPE C 16MMX7.7G | SUMITOMO BAKELITE SINGAPORE PTE LTD | 0 | NA | 52697.77 | SINGAPORE | N/A |
11/6/2023 | 39094010000 | MOLDING COMPOUND SUMIKON RESIN TABLET MCC-G700FGT1448-Q EME-G700 TYPE FGT 14MMX4.8G | SUMITOMO BAKELITE SINGAPORE PTE LTD | 0 | NA | 2164.42 | SINGAPORE | N/A |
11/6/2023 | 39094010000 | MOLDING COMPOUND SUMIKON RESIN TABLET MCB-720N41 EME-E670 TYPE C 14MMX4.5G | SUMITOMO BAKELITE SINGAPORE PTE LTD | 0 | NA | 1249.08 | SINGAPORE | N/A |