1/18/2021 | 84659110 | METALIZED SUBSTRATE | 3 | PACKAGE | 72721.71 | MALAYSIA | **** | TONG HSING ELECTRONICS PHIL., INC. (PLANT 2) (CIBP) | Get Detailed Shipment Records
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1/16/2021 | 84659110 | METALIZED SUBSTRATE | 4 | PACKAGE | 108000.42 | MALAYSIA | **** | TONG HSING ELECTRONICS PHIL., INC. (PLANT 2) (CIBP) |
1/25/2021 | 84659110 | METALIZED SUBSTRATE | 4 | PACKAGE | 119302.87 | MALAYSIA | **** | TONG HSING ELECTRONICS PHIL., INC. (PLANT 2) (CIBP) |
1/30/2021 | 84659110 | METALIZED SUBSTRATE | 2 | CARTON | 5054.04 | MALAYSIA | **** | TONG HSING ELECTRONICS PHILS INC. |
1/20/2021 | 84659110 | METALIZED SUBSTRATE | 3 | PACKAGE | 73101.9 | MALAYSIA | **** | TONG HSING ELECTRONICS PHIL., INC. (PLANT 2) (CIBP) |
1/29/2021 | 84659110 | METALIZED SUBSTRATE | 8 | PACKAGE | 281233.84 | MALAYSIA | **** | TONG HSING ELECTRONICS PHIL., INC. (PLANT 2) (CIBP) |
1/25/2021 | 84659110 | METALIZED SUBSTRATE | 4 | PACKAGE | 119302.87 | MALAYSIA | **** | TONG HSING ELECTRONICS PHIL., INC. (PLANT 2) (CIBP) |
1/29/2021 | 84659110 | METALIZED SUBSTRATE | 4 | CARTON | 16522.7 | MALAYSIA | **** | TONG HSING ELECTRONICS PHILS INC. |
1/6/2021 | 84659110 | METALIZED SUBSTRATE | 6 | PACKAGE | 190810.37 | MALAYSIA | **** | TONG HSING ELECTRONICS PHIL., INC. (PLANT 2) (CIBP) |
1/2/2021 | 84659110 | METALIZED SUBSTRATE | 2 | PACKAGE | 38411.99 | MALAYSIA | **** | TONG HSING ELECTRONICS PHIL., INC. (PLANT 2) (CIBP) |