1/4/2021 | 84733090 | P1273 SAP VCP TECH-(NOTE:THIS DECLARATION INCLUDES HS-84733090000,85423100200,-GOODS DESCRIPTION IS FOR THIS HS CODE. WEIGHT,QUANTITY AND VALUE FIGURES ARE FOR THE DECLARATION.) | 6 | PACKAGE | 173710.1 | MALAYSIA | **** | IBIDEN PHILIPPINES, INC. | Get Detailed Shipment Records
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1/18/2021 | 85423300 | IC AMPLIFIERS MOUNTED DICE IC-(NOTE:THIS DECLARATION INCLUDES HS-85423100200,85423300100,-GOODS DESCRIPTION IS FOR THIS HS CODE. WEIGHT,QUANTITY AND VALUE FIGURES ARE FOR THE DECLARATION.) | 1 | CARTON | 1890 | MALAYSIA | **** | STMICROELECTRONICS, INC. |
1/18/2021 | 85423100 | IC MCU MPU PROC MOUNTED DICE IC-(NOTE:THIS DECLARATION INCLUDES HS-85423100200,85423300100,-GOODS DESCRIPTION IS FOR THIS HS CODE. WEIGHT,QUANTITY AND VALUE FIGURES ARE FOR THE DECLARATION.) | 1 | CARTON | 5405.4 | MALAYSIA | **** | STMICROELECTRONICS, INC. |
1/3/2021 | 85423100 | FLIP CHIP BALL GRID ARRAY FCBGA 11-(NOTE:THIS DECLARATION INCLUDES HS-84733090000,85423100200,-GOODS DESCRIPTION IS FOR THIS HS CODE. WEIGHT,QUANTITY AND VALUE FIGURES ARE FOR THE DECLARATION.) | 1 | PACKAGE | 8193.92 | MALAYSIA | **** | IBIDEN PHILIPPINES, INC. |
1/3/2021 | 84733090 | P1273 SAP VCP TECH-(NOTE:THIS DECLARATION INCLUDES HS-84733090000,85423100200,-GOODS DESCRIPTION IS FOR THIS HS CODE. WEIGHT,QUANTITY AND VALUE FIGURES ARE FOR THE DECLARATION.) | 1 | PACKAGE | 8713.91 | MALAYSIA | **** | IBIDEN PHILIPPINES, INC. |
1/4/2021 | 85423100 | FLIP CHIP BALL GRID ARRAY FCBGA 11-(NOTE:THIS DECLARATION INCLUDES HS-84733090000,85423100200,-GOODS DESCRIPTION IS FOR THIS HS CODE. WEIGHT,QUANTITY AND VALUE FIGURES ARE FOR THE DECLARATION.) | 1 | PACKAGE | 16483.04 | MALAYSIA | **** | IBIDEN PHILIPPINES, INC. |
1/4/2021 | 84733090 | P1273 SAP VCP TECH-(NOTE:THIS DECLARATION INCLUDES HS-84733090000,85423100200,-GOODS DESCRIPTION IS FOR THIS HS CODE. WEIGHT,QUANTITY AND VALUE FIGURES ARE FOR THE DECLARATION.) | 6 | PACKAGE | 173710.1 | MALAYSIA | **** | IBIDEN PHILIPPINES, INC. |
1/4/2021 | 85423100 | FLIP CHIP BALL GRID ARRAY FCBGA 11-(NOTE:THIS DECLARATION INCLUDES HS-84733090000,85423100200,-GOODS DESCRIPTION IS FOR THIS HS CODE. WEIGHT,QUANTITY AND VALUE FIGURES ARE FOR THE DECLARATION.) | 1 | PACKAGE | 16483.04 | MALAYSIA | **** | IBIDEN PHILIPPINES, INC. |
1/18/2021 | 85423300 | IC AMPLIFIERS MOUNTED DICE IC-(NOTE:THIS DECLARATION INCLUDES HS-85423100200,85423300100,-GOODS DESCRIPTION IS FOR THIS HS CODE. WEIGHT,QUANTITY AND VALUE FIGURES ARE FOR THE DECLARATION.) | 1 | CARTON | 1890 | MALAYSIA | **** | STMICROELECTRONICS, INC. |
1/18/2021 | 85423100 | IC MCU MPU PROC MOUNTED DICE IC-(NOTE:THIS DECLARATION INCLUDES HS-85423100200,85423300100,-GOODS DESCRIPTION IS FOR THIS HS CODE. WEIGHT,QUANTITY AND VALUE FIGURES ARE FOR THE DECLARATION.) | 1 | CARTON | 5405.4 | MALAYSIA | **** | STMICROELECTRONICS, INC. |