3/31/2024 | 76169990 | ALUMINIUM HEAT SINK DIA 115MM X H95MM (600NOS/21CNY) | FOSHAN BAOHONG TECHNOLOGY CO LTD | 267 | KGS | 1783.09 | CHINA | CHENNAI AIR |
3/31/2024 | 76169990 | HXP55 CUS,THRM,CPU,2U,R740/XD,APCC (HEAT SINK) - 1002377270 | DELL GLOBAL BVSINGAPORE BRANCH | 6 | NOS | 64.58 | MALAYSIA | CHENNAI AIR |
3/31/2024 | 76169990 | ALUMINIUM HEAT SINK DIA 80MM X H180MM WHITE4 BLACK 4 (8NOS/19CNY) | FOSHAN BAOHONG TECHNOLOGY CO LTD | 0.4 | KGS | 21.51 | CHINA | CHENNAI AIR |
3/31/2024 | 76169990 | ALUMINIUM HEAT SINK DIA 82MM X H100MM WHITE4 BLACK 4 (8NOS/19CNY) | FOSHAN BAOHONG TECHNOLOGY CO LTD | 1.44 | KGS | 21.51 | CHINA | CHENNAI AIR |
3/31/2024 | 76169990 | HXP55 CUS,THRM,CPU,2U,R740/XD,APCC (HEAT SINK) - 1002377267 | DELL GLOBAL BVSINGAPORE BRANCH | 4 | NOS | 43.05 | MALAYSIA | CHENNAI AIR |
3/30/2024 | 76169990 | 6514A7873000-HEAT-SINK-HEAT-SINK SPREADER 180*59*1MM(PARTS FOR MFG OF PCBA FOR TELECOM NETWORK) | EMPLUS TECHNOLOGIES INC | 500 | PCS | 131.52 | TAIWAN | CHENNAI AIR |
3/30/2024 | 76169990 | Heat Sink 374724B60024G | ARROW ELECTRONICS INC | 336 | NOS | 348.82 | USA | BANGALORE AIR |
3/30/2024 | 76169990 | Heat Sink Passive 581002B02500G | ARROW ELECTRONICS INC | 250 | NOS | 251.32 | USA | BANGALORE AIR |
3/30/2024 | 76169990 | 1505-GM9200-0000 JMSB200AV2 HEAT SINK HEAT SINK AL/NANO 30*25*4.5MM W/3M ROHS (PART FOR USED IN THE MANUFACTURING OF SET | Shenzhen Skyworth Digital Technology CoLtd | 100000 | NOS | 5395.3 | CHINA | DADRI ICD |
3/30/2024 | 76169990 | Heat Sink Passive 374724B60024G | ARROW ELECTRONICS INC | 336 | NOS | 348.82 | USA | BANGALORE AIR |