3/31/2024 | 85423300 | IC-OP AMP;LV358G-S08-R,SOP-8,8P,TP,3.95x (1201-004368) (INTEGRATED CIRCUIT) | SAMSUNG ELECTRONICS TAIWAN CO LTD | 20000 | NOS | 978.54 | TAIWAN | CHENNAI AIR |
3/30/2024 | 85423300 | IC OPAMP VFB 1 CIRCUIT SOT23-6, ECCN EAR99 ADA4851-1WYRJZ-R7CT-NDEAR99(SUPPLY TO DRDO) | DIGIKEY ELECTRONICS | 500 | PCS | 684.03 | USA | DELHI AIR |
3/29/2024 | 85423300 | IC-INTEGARTED CIRCUIT MMIC AMPLIFIER-SURFACE MOUNT (TSS-13HLN+) (SIGNAL PROCESS COMPONENT) | MINI CIRCUITS | 20 | NOS | 224.19 | USA | CHENNAI AIR |
3/29/2024 | 85423300 | SC98D21996 IC,LNA,DFN,1.1MMX0.7MM-6L,6PINS,GNSS,AW1 (IC (INTEGRATED CIRCUIT)) (FOR MANUFACTURING OF PCBA OF MOTOROLA MOB | MOTOROLA MOBILITY LLC | 18876 | NOS | 348.43 | CHINA | DELHI AIR |
3/29/2024 | 85423300 | SC98E05803 IC,LNA,2.2MM X 1.9MM X 0.6MM,19PINS (IC (INTEGRATED CIRCUIT)) (FOR MANUFACTURING OF PCBA OF MOTOROLA MOBILE P | MOTOROLA MOBILITY LLC | 14325 | NOS | 4315.98 | CHINA | DELHI AIR |
3/29/2024 | 85423300 | SC98C64824 IC,LNA,41PSP,41PINS,B1,2,3,4,5,7,8,12,13 (IC (INTEGRATED CIRCUIT)) (FOR MANUFACTURING OF PCBA OF MOTOROLA MOB | MOTOROLA MOBILITY LLC | 104000 | NOS | 48767.14 | CHINA | DELHI AIR |
3/29/2024 | 85423300 | IC-INTEGARTED CIRCUIT AMPLIFIER MMIC 0.45-6GHz GAIN 12.5dB OUTPUT 19dBm (SAV-541+) (SIGNAL PROCESS COMPONENT) | MINI CIRCUITS | 50 | NOS | 84.48 | USA | CHENNAI AIR |
3/29/2024 | 85423300 | SC98D31581 IC,RF PA,3.0MM X 5.0MM X 0.745MM,30PINS (IC (INTEGRATED CIRCUIT)) (FOR MANUFACTURING OF PCBA OF MOTOROLA MOBI | MOTOROLA MOBILITY LLC | 3404 | NOS | 1768.26 | CHINA | DELHI AIR |
3/29/2024 | 85423300 | SC98D00953 IC,RF PA,2.4X2.8X0.53MM,30PINS,MT6308M (IC (INTEGRATED CIRCUIT)) (FOR MANUFACTURING OF PCBA OF MOTOROLA MOBIL | MOTOROLA MOBILITY LLC | 72000 | NOS | 52518.46 | CHINA | DELHI AIR |
3/29/2024 | 85423300 | IC-INTEGARTED CIRCUIT MMIC AMPLIFIER-SURFACE MOUNT (PHA-202+) (SIGNAL PROCESS COMPONENT) | MINI CIRCUITS | 20 | NOS | 229.04 | USA | CHENNAI AIR |