3/31/2024 | 85423200 | 1107-002918 IC-UNIVERSAL FLASH STORAGE THGJFJT2T85BA (IC MEMORY FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 9000 | PCS | 217102.72 | TAIWAN | DELHI AIR |
3/31/2024 | 85423200 | 1107-002918 IC-UNIVERSAL FLASH STORAGE THGJFJT2T85BA (IC MEMORY FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 4500 | PCS | 108551.36 | TAIWAN | DELHI AIR |
3/31/2024 | 85423200 | 1107-002918 IC-UNIVERSAL FLASH STORAGE THGJFJT2T85BA (IC MEMORY FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 7500 | PCS | 180918.94 | TAIWAN | DELHI AIR |
3/30/2024 | 85423200 | GH83-10615A JDM-CHIP SM-M556B,HQ133010000N0,SECURE E (IC MEMORY FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 25000 | PCS | 7925.11 | CHINA | DELHI AIR |
3/30/2024 | 85423200 | GH83-10615A JDM-CHIP SM-M556B,HQ133010000N0,SECURE E (IC MEMORY FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 5000 | PCS | 1585.02 | CHINA | DELHI AIR |
3/30/2024 | 85423200 | 1LNAKZT5VX-1-0.120 M24C08-RMN6TP MEMORIES-EEPROM(MOUNTED/DICE)( FOC) (VALUE FOR CUSTOM PURPOSE ONLY) | XXXXXXXXXX | 20 | NOS | 0.29 | CHINA | DELHI AIR |
3/30/2024 | 85423200 | 1975294 MICROCHIP TECHNOLOGY, 24C02C/P | XXXXXXXXXX | 25 | NOS | 7.76 | UNITED KINGDOM | DELHI AIR |
3/30/2024 | 85423200 | IC FRAM 256KBIT SPI 33MHZ 8SOP, ECCN EAR99 865-1284-1-NDEAR99(SUPPLY TO DRDO) | XXXXXXXXXX | 300 | PCS | 879.53 | USA | DELHI AIR |
3/29/2024 | 85423200 | SM38D82862 MEM,UFS,128GB,FBGA,153PINS (MEMORY IC (INTEGRATEDCIRCUIT)) (FOR MANUFACTURING OF PCBA OF MOTOROLA MOBILE PHO | XXXXXXXXXX | 3772 | NOS | 20623.1 | CHINA | DELHI AIR |
3/29/2024 | 85423200 | SM38D55740 MEMORY IC MEM,LPDDR4X,2GB,CXDB4CBAM-MK-A (BRAND MOTOROLA) (FOR MFG. OF PCBA FOR MOBILE PHONE) (CAPTIVE CONSUM | XXXXXXXXXX | 1 | NOS | 2.89 | CHINA | DELHI AIR |