3/30/2024 | 85423200 | GH83-10615A JDM-CHIP SM-M556B,HQ133010000N0,SECURE E (IC MEMORY FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 25000 | PCS | 7925.11 | CHINA | DELHI AIR |
3/30/2024 | 85423200 | GH83-10615A JDM-CHIP SM-M556B,HQ133010000N0,SECURE E (IC MEMORY FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 5000 | PCS | 1585.02 | CHINA | DELHI AIR |
3/30/2024 | 85423200 | 1LNAKZT5VX-1-0.120 M24C08-RMN6TP MEMORIES-EEPROM(MOUNTED/DICE)( FOC) (VALUE FOR CUSTOM PURPOSE ONLY) | XXXXXXXXXX | 20 | NOS | 0.29 | CHINA | DELHI AIR |
3/29/2024 | 85423200 | SM38D82862 MEM,UFS,128GB,FBGA,153PINS (MEMORY IC (INTEGRATEDCIRCUIT)) (FOR MANUFACTURING OF PCBA OF MOTOROLA MOBILE PHO | XXXXXXXXXX | 3772 | NOS | 20623.1 | CHINA | DELHI AIR |
3/29/2024 | 85423200 | SM38D55740 MEMORY IC MEM,LPDDR4X,2GB,CXDB4CBAM-MK-A (BRAND MOTOROLA) (FOR MFG. OF PCBA FOR MOBILE PHONE) (CAPTIVE CONSUM | XXXXXXXXXX | 1 | NOS | 2.89 | CHINA | DELHI AIR |
3/29/2024 | 85423200 | S938C84150 RF POWER AMPLIFIER IC LC2718AA000073+SAW,BAND7,1109,balanced,R (BRAND MOTOROLA) (FOR MFG. OF PCBA FOR MOBILE | XXXXXXXXXX | 3450 | NOS | 70.11 | CHINA | DELHI AIR |
3/29/2024 | 85423200 | SM38D54385 MEM,LPDDR4X,4GB,K4UBE3D4AB-MGCL (MEMORY IC (INTEGRATED CIRCUIT)) (FOR MANUFACTURING OF PCBA OF MOTOROLA MOBIL | XXXXXXXXXX | 14000 | NOS | 95700.31 | CHINA | DELHI AIR |
3/29/2024 | 85423200 | SM38D80312 MEMORY IC MEM,UMCP UFS-LPDDR4X,12GB+256GB,254FBGA(BRAND MOTOROLA) (FOR MFG. OF PCBA FOR MOBILE PHONE) (CAPTI | XXXXXXXXXX | 45000 | NOS | 1364073.3 | CHINA | DELHI AIR |
3/29/2024 | 85423200 | SM38D29401 MEM,UMCP,8+256,MT29VZZZCDA1SKPR-046 W.18 (MEMORYIC (INTEGRATED CIRCUIT)) (FOR MANUFACTURING OF PCBA OF MOTOR | XXXXXXXXXX | 12870 | NOS | 305528.52 | CHINA | DELHI AIR |
3/29/2024 | 85423200 | SM38D80312 MEM,U MCP UFSL PD DR4 X,12 GB +256GB,254FBGA MEMORY IC (FOR MFG OF PCBA OF MOTOROLA MOBILE PHONE) | XXXXXXXXXX | 2430 | NOS | 73616.11 | CHINA | DELHI AIR |