3/31/2024 | 85423100 | 25110000209T INTEGRATED CIRCUIT AW13412HDNR (USE IN MFG. OF PCBA OF MOBILE PHONE) | XXXXXXXXXX | 3000 | NOS | 73.94 | CHINA | DELHI AIR |
3/31/2024 | 85423100 | 25110000209T INTEGRATED CIRCUIT AW13412HDNR (USE IN MFG. OF PCBA OF MOBILE PHONE) | XXXXXXXXXX | 27000 | NOS | 665.46 | CHINA | DELHI AIR |
3/31/2024 | 85423300 | 1201-004367 IC-POWER AMP QM77098B,LGA,56P,TP,6.2X7.4 (IC AMPLIFIER FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 37500 | PCS | 102518.33 | CHINA | DELHI AIR |
3/31/2024 | 85423300 | GH83-10644A JDM-PMIC SM-M556B,HQ134100000S0,OVP CHIP (IC AMPLIFIER FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 3000 | PCS | 495.27 | CHINA | DELHI AIR |
3/31/2024 | 85423100 | ICS OB3375CPA SOP-8 SMD (ELECTRONIC COMPONENTS) | XXXXXXXXXX | 5000 | NOS | 125.95 | CHINA | DELHI AIR |
3/31/2024 | 85423100 | ICS OB2271QMP SOT23-6 SMD (ELECTRONIC COMPONENTS) | XXXXXXXXXX | 10000 | NOS | 103.52 | CHINA | DELHI AIR |
3/31/2024 | 85423100 | 25110000209T INTEGRATED CIRCUIT AW13412HDNR (USE IN MFG. OF PCBA OF MOBILE PHONE) | XXXXXXXXXX | 12000 | NOS | 295.76 | CHINA | DELHI AIR |
3/31/2024 | 85423900 | GH83-10556A JDM-RF CHIP SM-M556B,HQ14008000180,L-PAM (IC FORSAMSUNG MANUFACTURING) | XXXXXXXXXX | 16000 | PCS | 11629.1 | CHINA | DELHI AIR |
3/31/2024 | 85423900 | P000067331/00100 1200203000019A AW87358CSR INTEGRATED CIRCUIT (PARTS FOR MANUFACTURING OF MOBILE PHONE) | XXXXXXXXXX | 67500 | NOS | 8338.92 | CHINA | DELHI AIR |
3/31/2024 | 85423300 | GH83-10547A JDM-PMIC SM-M556B,HQ134110001M0,PUMP CHA (IC AMPLIFIER FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 15000 | PCS | 3858.89 | CHINA | DELHI AIR |