9/22/2023 | 85051190 | 3301-002356 BEAD-SMD 1000OHM/100MHZ,1.6X0.8MM,TP,0.3 (FERRITE CORE FOR MANUFACTURING OF PBA ASSY OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 4000 | PCS | 13.46 | JAPAN | SEOUL INCHEON INT |
9/22/2023 | 85051190 | 3301-002356 BEAD-SMD 1000OHM/100MHZ,1.6X0.8MM,TP,0.3 (FERRITE CORE FOR MANUFACTURING OF PBA ASSY OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 12000 | PCS | 40.37 | JAPAN | SEOUL INCHEON INT |
9/22/2023 | 85051190 | 3301-002356 BEAD-SMD 1000OHM/100MHZ,1.6X0.8MM,TP,0.3 (FERRITE CORE FOR MANUFACTURING OF PBA ASSY OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 4000 | PCS | 13.46 | JAPAN | SEOUL INCHEON INT |
9/15/2023 | 85051190 | 3301-002356 BEAD-SMD 1000OHM/100MHZ,1.6X0.8MM,TP,0.3 (FERRITE CORE FOR MANUFACTURING OF PBA ASSY OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 28000 | PCS | 93.17 | JAPAN | SEOUL INCHEON INT |
9/15/2023 | 85051190 | 3301-002356 BEAD-SMD 1000OHM/100MHZ,1.6X0.8MM,TP,0.3 (FERRITE CORE FOR MANUFACTURING OF PBA ASSY OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 16000 | PCS | 53.24 | JAPAN | SEOUL INCHEON INT |
9/15/2023 | 85051190 | 3301-002356 BEAD-SMD 1000OHM/100MHZ,1.6X0.8MM,TP,0.3 (FERRITE CORE FOR MANUFACTURING OF PBA ASSY OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 12000 | PCS | 39.93 | JAPAN | SEOUL INCHEON INT |
9/15/2023 | 85051190 | 3301-002356 BEAD-SMD 1000OHM/100MHZ,1.6X0.8MM,TP,0.3 (FERRITE CORE FOR MANUFACTURING OF PBA ASSY OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 12000 | PCS | 39.93 | JAPAN | SEOUL INCHEON INT |
9/15/2023 | 85051190 | 3301-002356 BEAD-SMD 1000OHM/100MHZ,1.6X0.8MM,TP,0.3 (FERRITE CORE FOR MANUFACTURING OF PBA ASSY OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 8000 | PCS | 26.62 | JAPAN | SEOUL INCHEON INT |
9/15/2023 | 85051190 | 3301-002356 BEAD-SMD 1000OHM/100MHZ,1.6X0.8MM,TP,0.3 (FERRITE CORE FOR MANUFACTURING OF PBA ASSY OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 16000 | PCS | 53.24 | JAPAN | SEOUL INCHEON INT |
9/15/2023 | 85051190 | 3301-002356 BEAD-SMD 1000OHM/100MHZ,1.6X0.8MM,TP,0.3 (FERRITE CORE FOR MANUFACTURING OF PBA ASSY OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 4000 | PCS | 13.31 | JAPAN | SEOUL INCHEON INT |