2/8/2024 | 38180010 | D998-115L GLASS PASTE | XXXXXXXXXX | 1000 | GMS | 1772.17 | USA | BANGALORE AIR |
9/22/2023 | 38180010 | SILICON WAFER ,4" DIA .,P-TYPE,100 RES:0.005-0.001 OHM.CM,SSP,EPI GRADE THICKNESS:525UM (DETAILS AS PER INVOICE) | XXXXXXXXXX | 25 | NOS | 301.35 | USA | HONG KONG |
9/22/2023 | 38180010 | SILICON WAFER ,4" DIA .,N-TYPE,100 RES:0.005-0.001 OHM.CM,SSP,EPI GRADE THICKNESS:525UM (DETAILS AS PER INVOICE) | XXXXXXXXXX | 25 | NOS | 301.35 | USA | HONG KONG |
9/22/2023 | 38180010 | SILICON WAFER ,4" DIA .,P-TYPE,111 RES:0.005-0.001 OHM.CM,SSP,EPI GRADE THICKNESS:525UM (DETAILS AS PER INVOICE) | XXXXXXXXXX | 50 | NOS | 602.7 | USA | HONG KONG |
5/13/2023 | 38180010 | SI-WAFER 4", PRIME,N/AS,(100),SSP(ITEM NO-WSI04-1102001)(DTLS. A/P INV)(FOR RESEARCH PURPOSE ONLY) | XXXXXXXXXX | 50 | PCS | 3233.57 | USA | KOLKATA ACC |
5/13/2023 | 38180010 | SI-WAFER 4", PRIME,N/AS,(100),DSP(ITEM NO-WSI04-1510001)(DTLS. A/P INV)(FOR RESEARCH PURPOSE ONLY) | XXXXXXXXXX | 25 | PCS | 2122.05 | USA | KOLKATA ACC |