3/24/2024 | 38180090 | 3INCH HPSI SIC WAFER | XXXXXXXXXX | 100 | PCS | 33394.53 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 600UM +/- 15UM | XXXXXXXXXX | 25 | NOS | 371 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 525UM +/- 25UM | XXXXXXXXXX | 25 | NOS | 396.59 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 525UM +/- 25UM | XXXXXXXXXX | 50 | NOS | 511.72 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 500UM +/- 15UM | XXXXXXXXXX | 25 | NOS | 307.03 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 500UM +/- 25UM | XXXXXXXXXX | 50 | NOS | 588.48 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 3 INCH INTRINSIC WAFER THICKNESS: 1000UM +/- 25UM | XXXXXXXXXX | 25 | NOS | 716.41 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 500UM +/- 25UM | XXXXXXXXXX | 50 | NOS | 562.9 | JAPAN | DELHI AIR |
12/12/2023 | 38180010 | HYDROGEN ANNEALED SILICON PRODUCT WAFERS (RESEARCH PURPOSE ONLY) 38 | XXXXXXXXXX | 2000 | NOS | 151252.37 | JAPAN | DELHI ACC |
11/25/2023 | 38180010 | 4INCH SOI WAFER | XXXXXXXXXX | 6 | NOS | 4116.77 | JAPAN | BANGALORE ACC |