3/24/2024 | 38180090 | 3INCH HPSI SIC WAFER | XXXXXXXXXX | 100 | PCS | 33394.53 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 600UM +/- 15UM | XXXXXXXXXX | 25 | NOS | 371 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 525UM +/- 25UM | XXXXXXXXXX | 25 | NOS | 396.59 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 525UM +/- 25UM | XXXXXXXXXX | 50 | NOS | 511.72 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 500UM +/- 15UM | XXXXXXXXXX | 25 | NOS | 307.03 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 500UM +/- 25UM | XXXXXXXXXX | 50 | NOS | 588.48 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 3 INCH INTRINSIC WAFER THICKNESS: 1000UM +/- 25UM | XXXXXXXXXX | 25 | NOS | 716.41 | JAPAN | DELHI AIR |
2/24/2024 | 38180090 | 4INCH WAFER THICKNESS: 500UM +/- 25UM | XXXXXXXXXX | 50 | NOS | 562.9 | JAPAN | DELHI AIR |
8/23/2023 | 38180090 | CONDUCTOR PASTE TR-4846 ( PASTE FOR HYBRID IC) | XXXXXXXXXX | 500 | GMS | 8642.23 | JAPAN | SAHAR AIR CARGO ACC |
8/21/2023 | 38180090 | HIGH PRIORITY SILICON WAFER FOR RESEARCH 2*TYPE25 PIECES-MODEL:2-960-63-MAKER:ASONE (AS PER INVOICE) | XXXXXXXXXX | 3 | NOS | 3877.08 | JAPAN | AHEMDABAD AIR ACC |