| 3/28/2024 | 35069900 | FUH137#&LOCTITE HHD 3545F Adhesive,090-0009-5672:4'4-methylenediphenyl diisocyanate 10-30%,3-(Trimethoxysilyl)propyl isocyanate 0.1-1%,o-(p-Isocyanatobenzyl)phenyl isocyanate 0.1-1%, ... 30ML/UNA | XXXXXXXXXX | 4.5 | KGM | 2154.15 | China | NA |
| 3/28/2024 | 35069900 | CMT-1011B-DN#&CMT-1011B-DN liquid adhesive, used in the film coating process, TP includes ETHYL ACETATE 39-42%, TOLUENE 8-10%, ACETONE 14 ~ 17%, Propyl Acetate 1 ~3%... | XXXXXXXXXX | 360 | KGM | 1401.012 | South Korea | NA |
| 3/20/2024 | 35069900 | FUH137#&Keo N-Sil8516W,090-2005-5672-V, Silane terminated 16%, Aluminium oxide 79%, Trimethoxyvinylsilane 3%, N-(3-(dimethoxymethylsilyl)propyl)ethylenediamine) 2%, 720G/UNA | XXXXXXXXXX | 144 | KGM | 14270.4 | China | NA |
| 3/11/2024 | 35069900 | FUH137#&LOCTITE HHD 3545F Adhesive,090-0009-5672:4'4-methylenediphenyl diisocyanate 10-30%,3-(Trimethoxysilyl)propyl isocyanate 0.1-1%,o-(p-Isocyanatobenzyl)phenyl isocyanate 0.1-1%, ..., 30ML/UNA | XXXXXXXXXX | 4.5 | KGM | 2154.15 | China | NA |
| 3/8/2024 | 35069900 | FUH137#&Keo N-Sil8516W,090-2005-5672-V, Silane terminated 16%, Aluminium oxide 79%, Trimethoxyvinylsilane 3%, N-(3-(dimethoxymethylsilyl)propyl)ethylenediamine) 2%, 720G/UNA | XXXXXXXXXX | 144 | KGM | 14270.4 | China | NA |
| 3/4/2024 | 35069900 | S-dine glue #3320A, used in the production of fuses and circuit breakers, main ingredients: bisphenol A and epichlorohydrin(25068-38-6)70-75%,P-tert-butylphenyl1-(2,3 -epoxy)propyl ether15-20%,4kg/box/X03320 | XXXXXXXXXX | 36 | KGM | 606.0924 | Japan | NA |
| 3/2/2024 | 35069900 | FUH137#&LOCTITE HHD 3545F Adhesive,090-0009-5672:4'4-methylenediphenyl diisocyanate 10-30%,3-(Trimethoxysilyl)propyl isocyanate 0.1-1%,o-(p-Isocyanatobenzyl)phenyl isocyanate 0.1-1%, ...,30ML/UNA | XXXXXXXXXX | 4.5 | KGM | 2194.2 | China | NA |
| 2/28/2024 | 35069900 | BM026-CONFORMAL COATING#&Product polishing glue CF-8600F(LV) includes: OctamethyltrisiloxaneSiloxanes and silicones, di-Me, Me methoxy, methoxy Ph polymers with Me Ph, Trimethoxy, Toluene < 5%,5SILCS0001. | XXXXXXXXXX | 400 | KGM | 14447.64 | South Korea | NA |
| 2/20/2024 | 35069900 | Glue for mounting components on circuit boards, type CX-8600B, ingredients: Siloxanes and Silicones, di-Me, Me methoxy 70~80%, Trimethoxy(methyl)silane 1~10%, Toluene 20~30%, 100% new | XXXXXXXXXX | 36 | KGM | 1772.0208 | South Korea | NA |
| 2/15/2024 | 35069900 | HV03-BOND-SA2235#&Glue SA2235-V20 10G-M 10ML-SEMN has Epoxy resin (MW 700), [3-(2,3-epoxypropoxy)propyl] trimethoxysilane, 100% new product, packaged 10g/1 bottle | XXXXXXXXXX | 2000 | GRM | 6862.8 | Japan | NA |