| 3/29/2024 | 38101000 | YN00000001403#&Solder flux TF-9000-5B ingredients (Natural resin, Stearic acid resin, Synthetic resin, Activator, Carboxylic acid, Mixed alcohol solvent, Anti-volatile agent). 100% new | XXXXXXXXXX | 1320 | LTR | 5835.72 | China | NA |
| 3/29/2024 | 38101000 | C10-000427#&Mold cleaner (450ml/bottle) JS-801 (bottle=bottle), ingredients: Butane 50%, C8 ~ C12 mixed solvent 37%, Methyl silicone oil 10%, High temperature grease 3% , new 100% | XXXXXXXXXX | 480 | UNA | 1014.24 | Vietnam | NA |
| 3/28/2024 | 38101000 | Circuit board cleaning liquid 14KG/barrel (ingredients: solvent S97, methylal+ Butyl Cellosolve+ IPA), 100% new product#&VN | XXXXXXXXXX | 14 | KGM | 35.2702 | VIETNAM | NA |
| 3/28/2024 | 38101000 | J45840#&Solvent DSP 80/100 (A liquid solvent, for cleaning metal surfaces). 100% new product | XXXXXXXXXX | 200 | KGM | 341.32 | China | NA |
| 3/28/2024 | 38101000 | Soldering flux TF-9000-5B (YN00000001403) ingredients (Natural resin, Stearic acid resin, Synthetic resin, Activator, Carboxylic acid, Mixed alcohol solvent, Anti-volatile agent). 100% new#&CN | XXXXXXXXXX | 1320 | LTR | 5835.72 | VIETNAM | NA |
| 3/28/2024 | 38101000 | Mold cleaning agent JS-803 (450ml/bottle, 24 bottles/carton) (bottle=bottle) (Butane 38%, ISO alkane solvent 45%), 100% new | XXXXXXXXXX | 15 | PAIL | 944.7375 | Vietnam | NA |
| 3/27/2024 | 38101000 | Soldering paste L20-BLT5-TYPE4 500G (Bismuth 45-55%, Tin 35-45%, Rosin 1-10%, Solvent 1-10%), 100% new | XXXXXXXXXX | 2 | KGM | 185.7 | Malaysia | NA |
| 3/27/2024 | 38101000 | Solder paste M40-LS720 TYPE4 500G (Tin 80-90%, Bismuth 0.1-3%, Silver 0.9%, Copper 0.1-3%, Rosin 1-10%, Solvent 1-10%), 100% new | XXXXXXXXXX | 1 | KGM | 78.21 | Malaysia | NA |
| 3/27/2024 | 38101000 | Soldering paste S70G TYPE4 500G (Tin 80-90%, Silver 2.7%, Copper 0.1-3%, Rosin 1-10%, Solvent 1-10%), 100% new | XXXXXXXXXX | 60 | KGM | 5306.4 | Malaysia | NA |
| 3/27/2024 | 38101000 | 61V-100-0023R# & LK Soldering Paste (HH contains tin to support soldering components on the phone circuit board). TP: Tin(85%), Silver(2.6%), Copper(0.4%), Modifiedrosin(4.8% ),Solvent(3.5%),Activator(2.5%),Thixotropic agent(1.2%) | XXXXXXXXXX | 300000 | GRM | 22770 | Malaysia | NA |