| 3/29/2024 | 35061000 | 322000610777 UV glue, thermally conductive glue (Adhesive NE9680), 30ML/PCS, TP: 2,5-Dibromothiophene-3-carbaldehyde (CAS: 18934-00-4); 3,4-Epoxycyclohexylmethyl (CAS: 2386-87-0), 100% new product#&CN | XXXXXXXXXX | 13740 | MLT | 10603.158 | VIETNAM | NA |
| 3/29/2024 | 35061000 | 322000605544-UV glue, thermally conductive glue (Adhesive 14716), 30ML/PCS TP: Polydimethylsiloxane (CAS: 63148-62-9), Alumina (CAS: 1344-28-1), Zinc Oxide (CAS 1314-13-2 ) (7-15%), 100% brand new #&CN | XXXXXXXXXX | 5370 | MLT | 4925.364 | VIETNAM | NA |
| 3/21/2024 | 35061000 | 502000231#&Thermal conductive adhesive TM200-L,TP: Organosiloxane Polymer (68083-19-2) (20-30%), Thermally conductive filler(1344-28-1)(70-80%). 100% New | XXXXXXXXXX | 1820 | GRM | 55.692 | China | NA |
| 3/18/2024 | 35061000 | Thermally Conductive Silicone, type CN8880, brand DOWSIL, 70% Aluminum oxide 1344-28-1, 30% petrolin 8002-74-2, CAS 1344-28-1; 1kg/bottle ,100% new | XXXXXXXXXX | 25000 | GRM | 452.5 | China | NA |
| 3/15/2024 | 35061000 | EA4100 thermally conductive electronic component adhesive has ingredients (Calcium Carbonate, Dimethyl siloxane, Aluminum hydroxide...), packaged 300ml-420g/PCE used to connect electronic products. 100% new | XXXXXXXXXX | 1776 | UNA | 8613.6 | South Korea | NA |
| 3/14/2024 | 35061000 | 502000231#&Thermal conductive adhesive TM200-L,TP: Organosiloxane Polymer (68083-19-2) (20-30%), Thermally conductive filler(1344-28-1)(70-80%). 100% New | XXXXXXXXXX | 2400 | GRM | 73.68 | China | NA |
| 3/12/2024 | 35061000 | 502000231#&Thermal conductive adhesive TM200-L,TP: Organosiloxane Polymer (68083-19-2) (20-30%), Thermally conductive filler(1344-28-1)(70-80%). 100% New | XXXXXXXXXX | 560 | GRM | 17.136 | China | NA |
| 3/9/2024 | 35061000 | Dowsil TC 4525 AB THERMALLY CONDUCTIVE GAP FILLER A: WHITE B: BLUE, 50ML=142G-SET - Adhesive used in electronic circuit boards (1 set includes 2 pce). Code TC-4525. New 100% | XXXXXXXXXX | 140 | SET | 1956.682 | Japan | NA |
| 3/5/2024 | 35061000 | 3M Thermally Conductive Epoxy Adhesive TC-2810,50ml/bottle, used in electronics (TP:epoxy resin30-70%, boron nitride20-30%,methyl methacrylate - butadiene - styrene polymer5-10%), new 100% | XXXXXXXXXX | 96 | UNA | 4178.7168 | Singapore | NA |
| 3/5/2024 | 35061000 | P39340001#&AA201 adhesive, main ingredient: cyanoacrylate, specification: 1kg/bottle, used to thermally bond various materials in the factory. 100% new#&JP | XXXXXXXXXX | 15 | UNA | 13.4805 | Japan | NA |