3/29/2024 | 35069900 | MD-NL10#&Silicone Sealant B, HUITIAN, 5299W-S, 2kg/drum, TP: Methyl silicone oil, ethyl silicate, 3-aminopropyltriethoxysilane, 3-glycidyl ether oxypropyl trimethoxysilane /20.07.001.0013 | XXXXXXXXXX | 220 | KGM | 528 | China | NA |
3/28/2024 | 35069900 | MM900005277#&SX-ECA52LL ADHESIVE (Contains Copper and its compounds 30-40%; Silver 10-20%; 3-Methoxy-3-methyl-1-butanol, Diethylene glycol diethyl ether,) USED FOR ATTACHING COMPONENTS | XXXXXXXXXX | 1420 | GRM | 10877.768 | Japan | NA |
3/27/2024 | 35069900 | P0000ZC9009#&Liquid glue (700-NC Frekote), ingredients include: Dibutyl Ether: 10~30%, Octane: 01~05%, 100% new product | XXXXXXXXXX | 40 | PCE | 3998.064 | South Korea | NA |
3/26/2024 | 35069900 | JT-314 glue (ingredients: polyuhethane foam 25%, Ethyl butyl ether 60%, cyclohexanone 15%) 15kg /1 box = 10 boxes, 100% new product#&VN#&KXD | XXXXXXXXXX | 60 | KGM | 476.634 | VIETNAM | NA |
3/26/2024 | 35069900 | ADHESIVE/SW-860HF#&SW-860HF adhesive used to bond components, tp:Calcium Carbonate (cas:471-34-1) 31%, Diglycidyl ether epoxy (Low-Chlorine epoxy)(cas:25068-38-6 ): 30%,.... 100% new product | XXXXXXXXXX | 12 | KGM | 268.0248 | South Korea | NA |
3/25/2024 | 35069900 | 430-00420-003#&Acacia(tp:3,3'-[Oxidized bis(2,1ethyleneoxy)]dipropylamine;Modified bisphenol A diglycidyl ether;Epoxy resin;Amorphous silica;2,4,6-Tris(dimethylaminomethyl)phenol, 1 bottle=50g) 100% NEW | XXXXXXXXXX | 860.49 | GRM | 209.615364 | China | NA |
3/22/2024 | 35069900 | Epoxy glue for transformers and inductors (SW-860HF) (Main ingredients: Diglycidyl ether epoxy 30%, Silica 5%, Polyamine adduct 15%, Calcium Carbonate 31%), CAS code: 25068-38-6. New 100% | XXXXXXXXXX | 700 | KGM | 15750 | South Korea | NA |
3/22/2024 | 35069900 | DS-3020R#&Black 3M adhesive DS-3020 (10kg/can), ingredient DIGLYCIDYL ETHER OF DISPHENOL A (DGEBA) >80%; BUTYL GLYCIDYL ETHER <20%, 100% new | XXXXXXXXXX | 240 | KGM | 1570.008 | South Korea | NA |
3/19/2024 | 35069900 | EMS-EPOXY ADHESIVE#&EPOXY Glue NCA2380 (50cc/55g), used in electronic component manufacturing, main ingredients: Acrylated epoxy, Silicon dioxide, Epoxy Resin, Modified glycidyl ether, 100% new, 5EP-YB0001 | XXXXXXXXXX | 3200 | MLT | 6217.6 | South Korea | NA |
3/19/2024 | 35069900 | EMS-EPOXY ADHESIVE#&EPOXY Glue NCA2380 (50cc/55g), used in electronic component manufacturing, main ingredients: Acrylated epoxy, Silicon dioxide, Epoxy Resin, Modified glycidyl ether, 100% new, 5EP-YB0001 | XXXXXXXXXX | 800 | MLT | 1554.4 | South Korea | NA |