3/30/2024 | 38140000 | CA-90 V10-KD#&Solvent (CA-90 FLX29EML), 1 bottle=0.15kg, TP is 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl( 1,1'-biphenyl), Epoxy Resin &., for mixing with PSR-9000 FLX29EML Copper Board Coating | XXXXXXXXXX | 7.5 | KGM | 531.0285 | South Korea | NA |
3/22/2024 | 38140000 | CA-90 V10-KD#&Solvent (CA-90 FLX29EML), 1 bottle=0.15kg, TP is 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl( 1,1'-biphenyl), Epoxy Resin &., for mixing with PSR-9000 FLX29EML Copper Board Coating | XXXXXXXXXX | 10.5 | KGM | 746.0922 | South Korea | NA |
3/19/2024 | 38140000 | CA-90 V10-KD#&Solvent (CA-90 FLX29EML), 1 bottle=0.15kg, TP is 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl( 1,1'-biphenyl), Epoxy Resin &., for mixing with PSR-9000 FLX29EML Copper Board Coating | XXXXXXXXXX | 6 | KGM | 433.8396 | South Korea | NA |
3/11/2024 | 38140000 | CA-90 V10-KD#&Solvent (CA-90 FLX29EML), 1 bottle=0.15kg, TP is 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl( 1,1'-biphenyl), Epoxy Resin &., for mixing with PSR-9000 FLX29EML Copper Board Coating | XXXXXXXXXX | 4.5 | KGM | 314.62695 | South Korea | NA |
3/6/2024 | 38140000 | CA-90 V10-KD#&Solvent (CA-90 FLX29EML), 1 bottle=0.15kg, TP is 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl( 1,1'-biphenyl), Epoxy Resin &., for mixing with PSR-9000 FLX29EML Copper Board Coating | XXXXXXXXXX | 4.5 | KGM | 321.4377 | South Korea | NA |
2/23/2024 | 38140000 | CA-90 V10-KD#&Solvent (CA-90 FLX29EML), 1 bottle=0.15kg, TP is 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl( 1,1'-biphenyl), Epoxy Resin &., for mixing with PSR-9000 FLX29EML Copper Board Coating | XXXXXXXXXX | 3 | KGM | 240.078 | South Korea | NA |
2/20/2024 | 38140000 | 2.SY.040187.01#&Solvent MH-303 HARDENER ,tp:1-Ethoxy-2-(2-methoxyethoxy) ethane 50%,CAS:763-69-9,Diethylenetriamine 35%,CAS:111-40-0, Bisphenol A(2,3-dihydroxypropyl)glycidyl15%,CAS:76002-91-0 | XXXXXXXXXX | 7 | KGM | 767.2021 | South Korea | NA |
2/20/2024 | 38140000 | CA-90 V10-KD#&Solvent (CA-90 FLX29EML), 1 bottle=0.15kg, TP is 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl( 1,1'-biphenyl), Epoxy Resin &., for mixing with PSR-9000 FLX29EML Copper Board Coating | XXXXXXXXXX | 7.5 | KGM | 554.32875 | South Korea | NA |
2/20/2024 | 38140000 | Solvent MH-303 HARDENER,for diluting printing ink,tp:1-Ethoxy-2-(2-methoxyethoxy) ethane 50%,CAS:763-69-9,Diethylenetriamine 35%,CAS:111-40-0, Bisphenol A(2,3-dihydroxypropyl)glycidyl15%,CAS:76002-91-0#&KR | XXXXXXXXXX | 7 | KGM | 767.2021 | VIETNAM | NA |
2/16/2024 | 38140000 | CA-90 V10-KD#&Solvent (CA-90 FLX29EML), 1 bottle=0.15kg, TP is 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl( 1,1'-biphenyl), Epoxy Resin &., for mixing with PSR-9000 FLX29EML Copper Board Coating | XXXXXXXXXX | 3 | KGM | 211.6812 | South Korea | NA |