| 3/28/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller( Laminating RTR (OLD)): Size: phi 100 (730 mm) | XXXXXXXXXX | 2 | PCE | 514.186 | South Korea | NA |
| 3/28/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (LAMI #1 - #2): Size: phi 80 (740 mm ) | XXXXXXXXXX | 4 | PCE | 1028.372 | South Korea | NA |
| 3/28/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 80 (770 mm) | XXXXXXXXXX | 4 | PCE | 1028.372 | South Korea | NA |
| 3/28/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the circuit board exposure process. Hot roller (Laminating RTR (NEW)): Size: phi 80 (725 mm) | XXXXXXXXXX | 2 | PCE | 514.186 | South Korea | NA |
| 3/28/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 100 (770 mm) | XXXXXXXXXX | 2 | PCE | 514.186 | South Korea | NA |
| 2/23/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (LAMI #1 - #2): Size: phi 80 (740 mm )#&KR | XXXXXXXXXX | 4 | PCE | 2845.84 | VIETNAM | NA |
| 2/23/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 100 (770 mm)#&KR | XXXXXXXXXX | 2 | PCE | 1778.64 | VIETNAM | NA |
| 2/23/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the circuit board exposure process. Hot roller (Laminating RTR (NEW)): Size: phi 80 (725 mm) #&KR | XXXXXXXXXX | 2 | PCE | 1422.92 | VIETNAM | NA |
| 2/23/2024 | 84209110 | The steel hot roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 80 (770 mm)#&KR | XXXXXXXXXX | 4 | PCE | 2845.84 | VIETNAM | NA |
| 2/23/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller( Laminating RTR (OLD)): Size: phi 100 (730 mm) #&KR | XXXXXXXXXX | 2 | PCE | 1778.64 | VIETNAM | NA |