Latest Vietnam Import Data of Shenzhen optic technology under HS Code 85429000

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HS Code

85429000(3697)

Country

Port of Unloading

DATE	HS CODE	PRODUCT DESCRIPTION	EXPORTER	QUANTITY	UNIT	TOTAL VALUE USD	ORIGIN COUNTRY	PORT OF UNLOADING
3/22/2024	85429000	SD789AR50B01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SD789AR50B01), WLP process, 100% new TX 1 part DH 34 TK 106118747600/E11#&KR	XXXXXXXXXX	574528	PCE	29875.456	VIETNAM	NA
3/21/2024	85429000	SH634BSF0H01#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um;SH634BSF0H01), WLP process, 100% new	XXXXXXXXXX	84238	PCE	2105.95	South Korea	NA
3/21/2024	85429000	SHG93AXQ0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG93AXQ0H01), WLP process, 100% new	XXXXXXXXXX	675326	PCE	8103.912	South Korea	NA
3/21/2024	85429000	SRG52AR20B02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB): SRG52AR20B02), WLP process, 100% new	XXXXXXXXXX	293760	PCE	5875.2	South Korea	NA
3/21/2024	85429000	KH748ARB0000#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(RND): KH748ARB0000), WLP process, 100% new	XXXXXXXXXX	8444	PCE	227.988	South Korea	NA
3/21/2024	85429000	SH748AF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SH748AF30001, CSP process, 100% new	XXXXXXXXXX	941248	PCE	9412.48	South Korea	NA
3/21/2024	85429000	SHG89BF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SHG89BF30001, CSP process, 100% new	XXXXXXXXXX	965328	PCE	8687.952	South Korea	NA
3/21/2024	85429000	SXG35AGM0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SXG35AGM0001, CSP process, 100% new	XXXXXXXXXX	401888	PCE	8037.76	South Korea	NA
3/21/2024	85429000	SXG35BWD0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SXG35BWD0001, CSP process, 100% new	XXXXXXXXXX	225150	PCE	6754.5	South Korea	NA
3/21/2024	85429000	SR881ASC0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB)), 1.20.762mm;SR881ASC0H01), WLP process, 100% new	XXXXXXXXXX	822375	PCE	15625.125	South Korea	NA

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Exim Trade Data provides 100% genuine and the latest Import data of Shenzhen optic technology under HS code 85429000 Vietnam. We collect Import data of Shenzhen optic technology under HS code 85429000 with product anddate.Import data of Shenzhen optic technology under HS code 85429000 Vietnam helps to analyze Import price, companyname, port, importer and exporter, product description, quantity, market trends, and many other datapoints.International Trade data of a country helps the global exporters and importers to do analysis and marketresearch to find local suppliers and buyers in that country.

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