| 3/29/2024 | 38101000 | Preparation for cleaning the surface of refined copper plates before copper plating Macdermid Enthone-MACUSPEC VF-TH 200 BR. REPL., liquid (TP:Organic salt 0.1-1%,sulphuric acid:0.1-1%,copper sulphate:0.1-1%)(20L/can) | XXXXXXXXXX | 800 | LTR | 24769.84 | Taiwan | NA |
| 3/29/2024 | 56039400 | MC040000718#&Nonwoven fabric (lining) size 138cm/NA02 NATURAL 0.65mm SH 610 RAD EPM5 138cm 100% POLYESTER 270 GRAM | XXXXXXXXXX | 300 | MTR | 927 | Taiwan | NA |
| 3/29/2024 | 56039400 | MC040000715#&Nonwoven fabric (lining) size 138cm/NATURAL 0.45mm SH 410 RAD EPM5 138cm 100% POLYESTER 150 GRAM | XXXXXXXXXX | 100 | MTR | 233 | Taiwan | NA |
| 3/29/2024 | 38101000 | Preparation for cleaning the surface of refined copper plates before copper plating Macdermid Enthone-MACUSPEC VF-TH 200 BR. REPL., liquid (TP:Organic salt 0.1-1%,sulphuric acid:0.1-1%,copper sulphate:0.1-1%)(20L/can) | XXXXXXXXXX | 420 | LTR | 13004.166 | Taiwan | NA |
| 3/28/2024 | 38249999 | 07010102#&Al-chelate preparation containing 60-70% water; Sodium hydroxide 10-20%; Aliphatic carboxylic acid salt 10-20%; Monoethanolamine 1-5% used in plating industry - 20L/T. 100% new | XXXXXXXXXX | 640 | LTR | 3878.4 | Taiwan | NA |
| 3/28/2024 | 38249999 | CM-00347#&MICROFILL EVF-III Brightener solution contains 90-99% water, Sulfuric Acid < 1%, Formaldehyde 0.1 - < 1%, Organic Salt < 1%, Copper sulfate < 1%, used in plating process copper | XXXXXXXXXX | 100 | LTR | 2646 | Taiwan | NA |
| 3/28/2024 | 38249999 | 07020308#&Water mixture 50-60%; Tetrasodium salt of ethylenediamine-tetraacetic acid 30-40%; Propoxylated amine<1% used in plating industry - cuposit TM 253E electroless copper-20L/T.100% new | XXXXXXXXXX | 200 | LTR | 1020 | Taiwan | NA |
| 3/28/2024 | 38249999 | 07010102#&Al-chelate preparation containing 60-70% water; Sodium hydroxide 10-20%; Aliphatic carboxylic acid salt 10-20%; Monoethanolamine 1-5% used in plating industry - 20L/T. 100% new | XXXXXXXXXX | 200 | LTR | 1212 | Taiwan | NA |
| 3/28/2024 | 38249999 | 07020308#&Water mixture 50-60%; Tetrasodium salt of ethylenediamine-tetraacetic acid 30-40%; Propoxylated amine<1% used in plating industry - cuposit TM 253E electroless copper-20L/T.100% new | XXXXXXXXXX | 1000 | LTR | 5100 | Taiwan | NA |
| 3/28/2024 | 38249999 | 07010102#&Al-chelate preparation containing 60-70% water; Sodium hydroxide 10-20%; Aliphatic carboxylic acid salt 10-20%; Monoethanolamine 1-5% used in plating industry - 20L/T. 100% new | XXXXXXXXXX | 300 | LTR | 1818 | Taiwan | NA |