| 3/30/2024 | 34029019 | 0#&Chemical MJH H-CUPRUM K2 contains Dipyridyl: 0.5 +/- 0.4%; Potassium sodium tartrate 0.5 +/- 0.4%;DIHYDROGEN OXIDE: 99.0 +/- 0.8% used in copper plating.20L/can.100% new | XXXXXXXXXX | 740 | LTR | 6615.23 | South Korea | NA |
| 3/25/2024 | 34029019 | MJH H-CUPRUM K2 chemical contains Dipyridyl: 0.5 +/- 0.4%; Potassium sodium tartrate 0.5 +/- 0.4%;DIHYDROGEN OXIDE: 99.0 +/- 0.8% used in copper plating.20L/can.New 100%#&KR | XXXXXXXXXX | 740 | LTR | 6615.23 | VIETNAM | NA |
| 2/29/2024 | 34029019 | 0#&Chemical MJH H-CUPRUM K2 contains Dipyridyl: 0.5 +/- 0.4%; Potassium sodium tartrate 0.5 +/- 0.4%;DIHYDROGEN OXIDE: 99.0 +/- 0.8% used in copper plating.20L/can.100% new | XXXXXXXXXX | 340 | LTR | 3063.06 | South Korea | NA |
| 2/26/2024 | 34029019 | MJH H-CUPRUM K2 chemical contains Dipyridyl: 0.5 +/- 0.4%; Potassium sodium tartrate 0.5 +/- 0.4%;DIHYDROGEN OXIDE: 99.0 +/- 0.8% used in copper plating.20L/can.New 100%#&KR | XXXXXXXXXX | 340 | LTR | 3063.06 | VIETNAM | NA |
| 2/16/2024 | 34029019 | MJH H-CUPRUM K2 chemical contains Dipyridyl: 0.5 +/- 0.4%; Potassium sodium tartrate 0.5 +/- 0.4%;DIHYDROGEN OXIDE: 99.0 +/- 0.8% used in copper plating, 20L/can. 100% New | XXXXXXXXXX | 1000 | LTR | 6560 | South Korea | NA |
| 1/31/2024 | 34029019 | MJH H-CUPRUM K2 chemical contains Dipyridyl: 0.5 +/- 0.4%; Potassium sodium tartrate 0.5 +/- 0.4%;DIHYDROGEN OXIDE: 99.0 +/- 0.8% used in copper plating, 20L/can. 100% New | XXXXXXXXXX | 1000 | Liter | 6560 | South Korea | NA |
| 1/30/2024 | 34029019 | 0#&Chemical MJH H-CUPRUM K2 contains Dipyridyl: 0.5 +/- 0.4%; Potassium sodium tartrate 0.5 +/- 0.4%;DIHYDROGEN OXIDE: 99.0 +/- 0.8% used in copper plating.20L/can.100% new | XXXXXXXXXX | 300 | Liter | 2706.579 | South Korea | NA |
| 12/30/2023 | 34029019 | 0#&Chemical MJH H-CUPRUM K2 contains Dipyridyl: 0.5 +/- 0.4%; Potassium sodium tartrate 0.5 +/- 0.4%;DIHYDROGEN OXIDE: 99.0 +/- 0.8% used in copper plating. 100% new | XXXXXXXXXX | 540 | Liter | 5264 | South Korea | NA |
| 12/30/2023 | 34029019 | 0#&Chemical MJH H-CUPRUM K2 contains Dipyridyl: 0.5 +/- 0.4%; Potassium sodium tartrate 0.5 +/- 0.4%;DIHYDROGEN OXIDE: 99.0 +/- 0.8% used in copper plating. 100% new | XXXXXXXXXX | 540 | Liter | 5264 | South Korea | NA |
| 12/26/2023 | 34029019 | MJH H-CUPRUM K2 chemical contains Dipyridyl: 0.5 +/- 0.4%; Potassium sodium tartrate 0.5 +/- 0.4%;DIHYDROGEN OXIDE: 99.0 +/- 0.8% used in copper plating, 20L/can. 100% New | XXXXXXXXXX | 940 | Liter | 6166 | South Korea | NA |