3/30/2024 | 39219090 | T1003112606#&Epoxy resin sheet, reinforced with glass fiber (without adhesive sheet), used in manufacturing KSC type printed circuit boards]RSA_EV2020_FPCB_REAR_R0.5_DOT(MP)[VN]_M[DIC]1.0T_DZ-YU140HF/SS/REV_BA Size: 15.8*34.8mm | XXXXXXXXXX | 14400 | PCE | 640.8 | Vietnam | NA |
3/30/2024 | 39219090 | Non-porous plastic roll (reinforced) type DS 7402 BS DF 1037 R58, Dimensions: 500mm*100M, 40+/-10 microns thick (main ingredient Epoxy Resin Blend, glass cloth). 100% New | XXXXXXXXXX | 500 | MTK | 4486.75 | South Korea | NA |
3/30/2024 | 39219090 | T1003112600#&Epoxy resin sheet, reinforced with glass fiber (without adhesive sheet), used in manufacturing KSC type printed circuit boards]RSA_EV2020_FPCB_FRONT_R0.6_DOT(MP)[VN]_M[DIC]1.0T_DZ-YU140HF/SS2/REV_AY Size: 18.1*30mm | XXXXXXXXXX | 22680 | PCE | 1106.784 | Vietnam | NA |
3/30/2024 | 39219090 | RM-04-00034-V02#&PREPREG EM-888 - Synthetic fiber sheet impregnated with resin, used as a dielectric sheet in the production of electronic circuit boards (PCB), size 580*610 mm (M-12-P -0.035-01) | XXXXXXXXXX | 200 | PCE | 1972 | Taiwan | NA |
3/30/2024 | 39219090 | Compact HPL plastic sheet, code: 30927M-3, Dimensions: 1830*2135*12mm reinforced, made up of layers of paper pressed with melamine-formaldehyde resin, surface coated with melamine resin, 100% new product | XXXXXXXXXX | 30 | PCE | 1993.845 | China | NA |
3/30/2024 | 39219090 | Prepreg reinforcement board, a plastic sheet that connects the layers of printed circuit boards (expoxy resin, non-porous, plastic content: 66%), Dimensions: 21.5*24.5in, 100% new | XXXXXXXXXX | 192 | PCE | 220.8 | China | NA |
3/30/2024 | 39219090 | Compact HPL plastic sheet, code: 30927-3, Dimension: 1220*2440*6mm reinforced, made up of layers of paper pressed with melamine-formaldehyde resin, surface covered with melamine resin, 100% new product | XXXXXXXXXX | 50 | PCE | 1568.945 | China | NA |
3/30/2024 | 39219090 | Compact HPL plastic sheet, code: 30927M-3, Dimensions: 1830*2440*12mm reinforced, made up of layers of paper pressed with melamine-formaldehyde resin, surface covered with melamine resin, 100% new product | XXXXXXXXXX | 30 | PCE | 2283.972 | China | NA |
3/30/2024 | 39219090 | T1003111702#&Epoxy resin plate, reinforced with glass fiber (no adhesive sheet), used to produce KSC type printed circuit boards]RSA_EV2020_FPCB_FRONT_R0.6(MP)[VN][DIC]1.0T_DZ-YU140HF/SS1/REV_AY,Kt : 25.7*46.2 mm #&VN | XXXXXXXXXX | 51888 | PCE | 4685.4864 | VIETNAM | NA |
3/30/2024 | 39219090 | T1003111704#&Epoxy resin plate, reinforced with glass fiber (no adhesive sheet), used to produce KSC type printed circuit boards]RSA_EV2020_FPCB_FRONT_R0.6(MP)[VN][DIC]1.0T_DZ-YU140HF/SS2/REV_AY, Kt :18.1*30 mm#&VN | XXXXXXXXXX | 53328 | PCE | 2602.4064 | VIETNAM | NA |