3/19/2024 | 38249999 | DDLMHS000005#&SOLDERON(TM)ECT ADDITIVE solution,p:water 50-60%,Methanol 35-45%,Pyrocatechol 1-5%,4H-1-Benzopyran-4-one,2-(2,4-dihydroxyphenyl) -3,5,7-trihydroxy<1% used in PCB circuit board production, 100% new | XXXXXXXXXX | 640 | LTR | 6963.2 | China | NA |
1/22/2024 | 38249999 | DDLMHS000005#&SOLDERON(TM)ECT ADDITIVE solution,p:water 50-60%,Methanol 35-45%,Pyrocatechol 1-5%,4H-1-Benzopyran-4-one,2-(2,4-dihydroxyphenyl) -3,5,7-trihydroxy<1% used in PCB circuit board production, 100% new | XXXXXXXXXX | 160 | Liter | 1740.8 | China | NA |
1/17/2024 | 38249999 | UTB-PF-05MR Tin-bismuth plating additive 05MR for plating lines (Methanol: 60%, Isopropyl alcohol: 20%, Surfactant: 5%, Organic compound: 1%, Pyrocatechol: 1%, Water: 13%) | XXXXXXXXXX | 3 | Lon/Can (UNL) | 1535.72622 | Japan | NA |
1/17/2024 | 38249999 | UTB-PF-05M Tin-bismuth plating additive 05M for plating lines (Surfactant: 40%, Methanol: 25%, Pyrocatechol: 3%, Organic compound: 1%, Alkylsulfonic acid: 3%, Water CAS: 28% ) | XXXXXXXXXX | 3 | Lon/Can (UNL) | 1535.72622 | Japan | NA |
12/21/2023 | 38249999 | SOLDERON(TM)ECT ADDITIVE solution contains water50-60%,Methanol35-45%,Pyrocatechol 1-5%,4H-1-Benzopyran-4-one,2-(2,4-dihydroxyphenyl)-3,5,7-trihydroxy <1% used in electroplating, electronic circuit board production, 100% new | XXXXXXXXXX | 720 | Liter | 1751 | China | NA |
12/21/2023 | 38249999 | SOLDERON(TM)ECT ADDITIVE solution contains water50-60%,Methanol35-45%,Pyrocatechol 1-5%,4H-1-Benzopyran-4-one,2-(2,4-dihydroxyphenyl)-3,5,7-trihydroxy <1% used in electroplating, electronic circuit board production, 100% new | XXXXXXXXXX | 720 | Liter | 1751 | China | NA |
10/10/2023 | 38249999 | SOLDERON(TM) ECT ADDITIVE solution contains water 50-60%, Methanol 35-45%, Pyrocatechol 1-5%, 4H-1-Benzopyran-4-one,2-(2,4-dihydroxyphenyl)-3,5 ,7-trihydroxy <1% used in printed circuit board production, 100 new | XXXXXXXXXX | 500 | Liter | 5440 | China | NA |