| 3/28/2024 | 38249999 | CM-00169#&Cuposit 1120SR Copper Replenisher preparation used in plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4<1%, Water >98% (Omnishield 1120SR) | XXXXXXXXXX | 500 | LTR | 6065 | Japan | NA |
| 3/11/2024 | 38249999 | CM-00169#&Cuposit 1120SR Copper Replenisher preparation used in plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4<1%, Water >98% (Omnishield 1120SR) | XXXXXXXXXX | 100 | LTR | 1238 | Japan | NA |
| 3/11/2024 | 38249999 | CM-00169#&Cuposit 1120SR Copper Replenisher preparation used in plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4<1%, Water >98% (Omnishield 1120SR) | XXXXXXXXXX | 100 | LTR | 1238 | Japan | NA |
| 2/26/2024 | 38249999 | 07030236#&Copkia RIP AU-1 solution contains Aromatic nitro compound 98.6%, Lead acetate (Pb(CH3CO2)2.3H2O) 0.9%, Thionic compound 0.5% used to dissolve gold stuck on tank walls | XXXXXXXXXX | 30 | KGM | 989.118 | Japan | NA |
| 2/20/2024 | 38249999 | Cuposit 1120SR Copper Replenisher is a product containing Pyridine compound <1% and Sulfuric Acid <1% used in plating industry, 100% new | XXXXXXXXXX | 1280 | LTR | 13401.472 | Japan | NA |
| 2/1/2024 | 38249999 | CM-00169#&Cuposit 1120SR Copper Replenisher preparation used in plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4<1%, Water >98% (Omnishield 1120SR) | XXXXXXXXXX | 320 | LTR | 3961.6 | Japan | NA |
| 1/23/2024 | 38249999 | 07030236#&Copkia RIP AU-1 solution contains Aromatic nitro compound 98.6%, Lead acetate (Pb(CH3CO2)2.3H2O) 0.9%, Thionic compound 0.5% used to dissolve gold stuck to the tank walls - 10kg/Ctn. 100% New | XXXXXXXXXX | 20 | Kilograms | 640 | Japan | NA |
| 1/23/2024 | 38249999 | CM-00169#&Cuposit 1120SR Copper Replenisher preparation used in plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4<1%, Water >98% (Omnishield 1120SR) | XXXXXXXXXX | 100 | Liter | 1238 | Japan | NA |
| 1/17/2024 | 38249999 | Cuposit 1120SR Copper Replenisher is a product containing Pyridine compound <1% and Sulfuric Acid <1% used in plating industry, 100% new | XXXXXXXXXX | 320 | Liter | 3050.43008 | Japan | NA |
| 1/16/2024 | 38249999 | Electroplating additives in the production of PCB circuit boards: ORC-445R Plus (Palladium sulfate 1-4%, Boric acid <0.6%, Sodium hydroxide 1-4.5%, Pyridine <1%). New 100% | XXXXXXXXXX | 680 | Kilograms | 33360.8 | South Korea | NA |