| 3/28/2024 | 38249999 | CM-00169#&Cuposit 1120SR Copper Replenisher preparation used in plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4<1%, Water >98% (Omnishield 1120SR) | XXXXXXXXXX | 500 | LTR | 6065 | Japan | NA |
| 3/20/2024 | 29333100 | Piridine ( Pyridine ); C5H5N; (1 bottle = 500ml). 100% new. Belongs to line 25 TKN KNQ 106145852300 | XXXXXXXXXX | 2 | UNA | 64.6 | Japan | NA |
| 3/18/2024 | 29333100 | Piridine ( Pyridine ); C5H5N; (1 bottle = 500ml) | XXXXXXXXXX | 2 | UNA | 35.621 | Japan | NA |
| 3/11/2024 | 38249999 | CM-00169#&Cuposit 1120SR Copper Replenisher preparation used in plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4<1%, Water >98% (Omnishield 1120SR) | XXXXXXXXXX | 100 | LTR | 1238 | Japan | NA |
| 3/11/2024 | 38249999 | CM-00169#&Cuposit 1120SR Copper Replenisher preparation used in plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4<1%, Water >98% (Omnishield 1120SR) | XXXXXXXXXX | 100 | LTR | 1238 | Japan | NA |
| 3/8/2024 | 29055900 | 512874#&Preservative (kills bacteria, yeast, mold, repels insects) SANAI BAC SA, ingredient 2-Bromo-2-nitro-1 ,3-propanediol C3H6O4NBR, cas: 52-51-7 | XXXXXXXXXX | 20 | KGM | 183.7 | Japan | NA |
| 3/4/2024 | 34024990 | A0100028#&Enstrip S surface treatment (liquid) (aromatic nitro compound) | XXXXXXXXXX | 600 | LTR | 3714 | Japan | NA |
| 3/4/2024 | 34023990 | A0100022#&Aromatic Nitro compound 98.6%, Lead acetate (Pb (CH3COO)2 0.9%, Thionic powder 0.5% | XXXXXXXXXX | 10 | KGM | 311.7 | Japan | NA |
| 2/26/2024 | 38249999 | 07030236#&Copkia RIP AU-1 solution contains Aromatic nitro compound 98.6%, Lead acetate (Pb(CH3CO2)2.3H2O) 0.9%, Thionic compound 0.5% used to dissolve gold stuck on tank walls | XXXXXXXXXX | 30 | KGM | 989.118 | Japan | NA |
| 2/22/2024 | 29333100 | Piridin ( Pyridine ); C5H5N; ( 1 chai = 500ml) | XXXXXXXXXX | 3 | UNA | 42.3408 | Japan | NA |