| 3/29/2024 | 35069900 | 31#&Keo94H/T (isocyanate additives, cleaning naphtha, synthetic rubber)(100% new) | XXXXXXXXXX | 4020 | KGM | 8040 | Vietnam | NA |
| 3/29/2024 | 35069900 | N29#&glue 94H/T (ingredients include isocyanate additives, cleaning naphtha, synthetic rubber, 100% new product) | XXXXXXXXXX | 12390 | KGM | 24780 | Vietnam | NA |
| 3/28/2024 | 35069900 | Solder surface coating on circuit boards code EA6116, ingredients include: Isocyanate acrylate, Multifunctional acrylate, Modified acrylamide (50ML/una). 100% new product | XXXXXXXXXX | 180 | PCE | 6488.676 | China | NA |
| 3/28/2024 | 35069900 | FUH137#&LOCTITE HHD 3545F Adhesive,090-0009-5672:4'4-methylenediphenyl diisocyanate 10-30%,3-(Trimethoxysilyl)propyl isocyanate 0.1-1%,o-(p-Isocyanatobenzyl)phenyl isocyanate 0.1-1%, ... 30ML/UNA | XXXXXXXXXX | 4.5 | KGM | 2154.15 | China | NA |
| 3/28/2024 | 35069900 | Solder surface coating on circuit boards code EA6116, ingredients include: Isocyanate acrylate, Multifunctional acrylate, Modified acrylamide (50ML/una). 100% new product | XXXXXXXXXX | 270 | PCE | 9733.014 | China | NA |
| 3/28/2024 | 35069900 | CMT-1011B-DN#&CMT-1011B-DN liquid adhesive, used in the film coating process, TP includes ETHYL ACETATE 39-42%, TOLUENE 8-10%, ACETONE 14 ~ 17%, Propyl Acetate 1 ~3%... | XXXXXXXXXX | 360 | KGM | 1401.012 | South Korea | NA |
| 3/27/2024 | 35069900 | 99# & 94H/T Glue (prepared from 80% synthetic rubber, 10% Cleaning Naphtha, 10% Isocyanate additive), 100% new | XXXXXXXXXX | 6000 | KGM | 12000 | Vietnam | NA |
| 3/27/2024 | 35069900 | NPL56#&Glue 94H/T (ingredients include isocyanate additives, cleaning naphtha, synthetic rubber, 100% new product) | XXXXXXXXXX | 7020 | KGM | 14040 | Vietnam | NA |
| 3/20/2024 | 35069900 | FUH137#&Keo N-Sil8516W,090-2005-5672-V, Silane terminated 16%, Aluminium oxide 79%, Trimethoxyvinylsilane 3%, N-(3-(dimethoxymethylsilyl)propyl)ethylenediamine) 2%, 720G/UNA | XXXXXXXXXX | 144 | KGM | 14270.4 | China | NA |
| 3/19/2024 | 35069900 | 18333#&Golf ball glue (TP: Hexamethylene diisocyanate, oligomers; n-butyl acetate; hexamethylene-di-isocyanate), CMD according to section 4 TK: 106072424361/E31 | XXXXXXXXXX | 1.46 | KGM | 20.0312 | Taiwan | NA |