3/30/2024 | 34029013 | 0#&HVF CLEANER H3: Copper plating solution contains Monoethanolamine 30+/-5%, 2-Propanol 2+/-1%, Guanidine carbonate 3+/-1% and water, 20l/can.167/TB- KD1 dated March 30, 2020. 100% new | XXXXXXXXXX | 1440 | LTR | 4944.384 | South Korea | NA |
3/28/2024 | 34029013 | J45835#&SGP 2000 printing film surface cleaning chemicals, Ingredients: Triethanol Amine 20~35 %, 2-(2-butoxyethoxy)ethanol 15~30 %, Potassium hydroxide 33~63 %, 100% new | XXXXXXXXXX | 640 | LTR | 9882.176 | South Korea | NA |
3/26/2024 | 34029013 | Film surface cleaning chemicals in printing SGP 2000, Ingredients: Triethanol Amine 20~35 %, 2-(2-butoxyethoxy)ethanol 15~30 %, Potassium hydroxide 33~63 %, 100% new#&KR | XXXXXXXXXX | 640 | LTR | 9882.176 | VIETNAM | NA |
3/25/2024 | 34029013 | HVF CLEANER H3: Copper plating solution containing Monoethanolamine 30+/-5%, 2-Propanol 2+/-1%, Guanidine carbonate 3+/-1% and water, 20l/can.167/TB-KD1 day March 30, 2020. 100% New#&KR | XXXXXXXXXX | 1440 | LTR | 4944.384 | VIETNAM | NA |
3/21/2024 | 34029013 | Z0000000-419206 Ink remover EN-OS200 (ingredients 2-(2-BUTOXYETHOXY)ETHHANOL 10-15%,D-GLUCOPYRANOSIDE, C10-16-ALKYL 15-20%, GLUCONIC ACID, SODIUM SALT15-20% and water) , 1 tank=100L, 100% brand new#&VN | XXXXXXXXXX | 109 | PAIL | 74610.5 | VIETNAM | NA |
3/16/2024 | 34029013 | Cleaning additive used in tin plating PTC 365: 2-Aminoethanol 15%+/-3%, 2-Propanol 5%+/-2% and water, packaged 20l/can, 100% new product | XXXXXXXXXX | 80 | LTR | 335.2 | South Korea | NA |
3/16/2024 | 34029013 | HVF CLEANER H3: Copper plating solution contains Monoethanolamine 30+/-5%, 2-Propanol 2+/-1%, Guanidine carbonate 3+/-1% and water, 20l/can. 100% New | XXXXXXXXXX | 1400 | LTR | 4270 | South Korea | NA |
3/5/2024 | 34029013 | HVF CLEANER H3: Copper plating solution contains Monoethanolamine 30+/-5%, 2-Propanol 2+/-1%, Guanidine carbonate 3+/-1% and water, 20l/can. 100% New | XXXXXXXXXX | 640 | LTR | 1952 | South Korea | NA |
3/4/2024 | 34029013 | SM028#&Cleaning preparation CLEASER(NIKKASOLE RE) 18L/barrel, containing 1(or 2)-[2-methoxy(methyl)ethoxy]propanol(Cas.34590-94-8), 100% new | XXXXXXXXXX | 6 | BBL | 901.44 | Japan | NA |
3/1/2024 | 34029013 | SFC-300 cleaning solution used to clean electronic circuit boards (ingredients: 2-(2-BUTOXYETHOXY)ETHANOL 50% (112-34-5),Water 20% (7732-18-5) . New 100% | XXXXXXXXXX | 640 | LTR | 10880 | South Korea | NA |