3/30/2024 | 38249999 | FOC#&Thermal pad, composed of 86% aluminum oxide, 6% zinc oxide, 6% silicon rubber, 2% fiberglass, size 33*33*11mm, used in the functional testing phase of the heatsink , 100% new | XXXXXXXXXX | 338 | PCE | 60.84 | China | NA |
3/30/2024 | 38249999 | FOC#&Thermal pad, composed of 86% aluminum oxide, 6% zinc oxide, 6% silicon rubber, 2% glass fiber, size 34*34*20mm, used in the functional testing phase of the heatsink , 100% new | XXXXXXXXXX | 106 | PCE | 31.8 | China | NA |
3/30/2024 | 38249999 | FOC#&Thermal pad, composed of 86% aluminum oxide, 6% zinc oxide, 6% silicon rubber, 2% glass fiber, size 34*34*20mm, used in the functional testing phase of the heatsink , 100% new | XXXXXXXXXX | 106 | PCE | 24.38 | China | NA |
3/30/2024 | 38249999 | FOC#&Thermal pad, composed of 86% aluminum oxide, 6% zinc oxide, 6% silicon rubber, 2% glass fiber, size 34*34*20mm, used in the functional testing phase of the heatsink , 100% new | XXXXXXXXXX | 222 | PCE | 170.94 | China | NA |
3/30/2024 | 38249999 | FOC#&Thermal pad, composed of 86% aluminum oxide, 6% zinc oxide, 6% silicon rubber, 2% fiberglass, size 33*33*11mm, used in the functional testing phase of the heatsink , 100% new | XXXXXXXXXX | 48 | PCE | 12 | China | NA |
3/30/2024 | 38249999 | FOC#&Thermal pad, composed of 86% aluminum oxide, 6% zinc oxide, 6% silicon rubber, 2% glass fiber, size 34*34*20mm, used in the functional testing phase of the heatsink , 100% new | XXXXXXXXXX | 164 | PCE | 32.8 | China | NA |
3/30/2024 | 38249999 | FOC#&Thermal pad, composed of 65% aluminum oxide, 32% zinc oxide, 3% polymer, size 45*28*37mm, used in the functional testing phase of the heatsink, 100% new | XXXXXXXXXX | 58 | PCE | 17.98 | China | NA |
3/30/2024 | 38249999 | FY079#&Moisture-proof granules, ingredient Silicon dioxide 62.87% (7631-86-9); Aluminum oxide 17.7%(1344-28-1); Ferric oxide 7.73%(1309-37-1); Magnesium oxide 5.29%(1309-48-4)...,7511318 | XXXXXXXXXX | 1002 | PCE | 330.66 | Vietnam | NA |
3/30/2024 | 38249999 | 0#&Brown Oxide film forming agent in PCB production SD-288 (TP: 1,2,3-Benzotriazole 17-22%(95-14-7), Monoethanolamine 23-28%(141-43- 5), Additive 5-8%, Water 42-50%), 20kg/can. New 100% | XXXXXXXXXX | 500 | KGM | 2854.55 | Vietnam | NA |
3/30/2024 | 38249999 | A304000034-1#&TC5026 Thermal Cream, main ingredient is 70% processed aluminum oxide, net weight 1kg/bottle, used in heatsink production, 100% new | XXXXXXXXXX | 46 | KGM | 18860 | USA | NA |