| 3/27/2024 | 38249999 | 2534013-Varnish curing preparation with main ingredients including: organic peroxide, xylene, aliphatic hydrocarbon and cyclohexanone, liquid form - ADHESIVE,.TEC9652KU(Kyocera Chemical TEC9652KU,0.32kg/SH), 100% new | XXXXXXXXXX | 3.2 | KGM | 471.0848 | Japan | NA |
| 3/26/2024 | 38249999 | AX-Q2000 hydrogen peroxide water stabilizer. HH product contains a mixture of phosphate salts, sulphate, chloride... and additives, in acidic MT. Liquid. Used as a stabilizer for hydrogen peroxide (H2O2). | XXXXXXXXXX | 2625 | KGM | 1013.25 | Vietnam | NA |
| 3/26/2024 | 38249999 | Mixture of Sodium hydrogencarbonate and Compound of sodium carbonate with hydrogen peroxide (2:3) used for dyeing technology ITEM: RUCO-STAB LGA. (CAS Code 144-55-8) PTPL No. 983 SPOX (100% New) | XXXXXXXXXX | 1500 | KGM | 2250 | China | NA |
| 3/25/2024 | 38249999 | NO024#&Additive to increase peroxide properties in the vulcanization process of granular EVA used in the production of EVA shoe soles - SMB IB-50(133) tp 50% Acrylate derivative and 50%EVA, (10 bales, 20kg/bale) , 100% new | XXXXXXXXXX | 200 | KGM | 2018 | South Korea | NA |
| 3/25/2024 | 3824999990 | AX-Q2000.24#&AX-Q2000 hydrogen peroxide water stabilizer. HH product contains a mixture of phosphate salts, sulphate, chloride... and additives, in acidic MT. Liquid. Used as a stabilizer for hydrogen peroxide (H2O2).#&VN | XXXXXXXXXX | 2625 | KGM | 1013.25 | VIETNAM | NA |
| 3/22/2024 | 38249999 | The mixture of solutions used to clean PLC 2000 chemicals includes: AMMONIUM FLUORIDE 25-35%; HYDROGEN PEROXIDE 2-3% PHOSPHORIC ACID 3-5%. 20kg/can. 100% new#&VN | XXXXXXXXXX | 4500 | KGM | 8805.6 | VIETNAM | NA |
| 3/20/2024 | 38249999 | NL27#&Hydrogen peroxide water stabilizer AX-Q2000, HH preparation contains a mixture of phosphate, sulphate, chloride...and additives, in acidic environment, liquid form, used in textile dyeing without brand, 100% new | XXXXXXXXXX | 1250 | KGM | 866.25 | Vietnam | NA |
| 3/19/2024 | 3824999990 | Hydrogen peroxide water stabilizer AX-Q2000. HH product contains a mixture of phosphate salts, sulphate, chloride... and additives, in acid MT. Liquid Form, no brand. 100% new #&VN | XXXXXXXXXX | 1250 | KGM | 866.25 | VIETNAM | NA |
| 3/18/2024 | 38249999 | OCHW00003#&Chemical used to peel off the Ti layer on Wafer (WTE-100A), ingredients hydrogen peroxide 30%;WATER 70% used for striping (cleaning) parts before WLP (UN2014 / CLASS 5.1 / PG II), goods 100% new | XXXXXXXXXX | 400 | LTR | 4243.2 | South Korea | NA |
| 3/18/2024 | 38249999 | OCHW00002#&Chemical used to peel off the Cu layer on wafer (MKS-4000N PHS) for the striping process before WLP (NON-DG ), tp: DIwater 88.8%; Hydrogen peroxide 1.2%, Lactic Acid 5%, .., 100% new | XXXXXXXXXX | 500 | LTR | 5579 | South Korea | NA |