| 3/27/2024 | 38249999 | 07030103#&GLICOAT SMD Chemical # 100 ingredients containing Acetic acid(C2H4O2) 5%, Ammonia(NH3) <1%, Organic acid <1%, Imidazole derivative(s) <1% and water-20L/Can.New 100% | XXXXXXXXXX | 20 | LTR | 101.702 | Japan | NA |
| 3/26/2024 | 38249999 | 07020131#&MICROFILL THF LEVELER SOLUTION(TM) containing 90-99% Water, Sulfuric Acid < 1.0%, Copper sulfate < 1.0%, Imidazole polymer < 1.0% used in electroplating technology-20L/T.New 100 % | XXXXXXXXXX | 80 | LTR | 5855.2 | Taiwan | NA |
| 3/26/2024 | 38249999 | CM-00339#&Chemical used for coating and anti-oxidation of circuit boards GLICOAT-SMD F2(LX) (CH3COOH:9.9%, NH3<1%,Substituted imidazole derivative<1%,copper complexing agent<1%,Additive <1%,water>86.1%) | XXXXXXXXXX | 60 | UNK | 12454.62 | Japan | NA |
| 3/25/2024 | 38249999 | Additives in the circuit board plating process GLICOAT-SMD PT25C, Water 93%; Alcohol compound 3%; Imidazole 1%; Organic nitrogen 1%, Organic ammonium salt:1%; CAS code: Confidential, 100% new | XXXXXXXXXX | 40 | LTR | 3206.772 | Japan | NA |
| 3/12/2024 | 38249999 | 07020131#&MICROFILL THF LEVELER SOLUTION(TM) contains Water 90-99%, Sulfuric Acid < 1.0%, Copper sulfate < 1.0%, Imidazole polymer < 1.0% used in electroplating technology | XXXXXXXXXX | 100 | LTR | 7319 | Taiwan | NA |
| 3/8/2024 | 38249999 | METAL SURFACE ADDITIVE CR-72A-Chemical preparation used in plating, containing glycine, imidazole and additives in aqueous medium, liquid form.(1012/KD3, August 14, 2020) | XXXXXXXXXX | 450 | LTR | 6126.615 | Taiwan | NA |
| 3/8/2024 | 38249999 | METAL SURFACE ADDITIVE CR-72B - Chemical preparation used in plating, containing glycine, imidazole and additives in aqueous medium, liquid form. (1012/KD3, August 14, 2020) | XXXXXXXXXX | 275 | LTR | 4212.065 | Taiwan | NA |
| 2/27/2024 | 38249999 | 07030100#&Chemical GLICOAT SMD F2 (LX) PK-G ingredients contain Acetic acid (C2H4O2) 9.9%, Ammonia(NH3)<1%, Imidazole derivative <1%, Additive<1% and water-20L/Box. 100% New | XXXXXXXXXX | 340 | LTR | 3110.728 | Japan | NA |
| 2/27/2024 | 38249999 | 07030103#&GLICOAT SMD Chemical # 100 ingredients containing Acetic acid(C2H4O2) 5%, Ammonia(NH3) <1%, Organic acid <1%, Imidazole derivative(s) <1% and water-20L/Can.New 100% | XXXXXXXXXX | 100 | LTR | 508.29 | Japan | NA |
| 2/26/2024 | 38249999 | 07030236#&Copkia RIP AU-1 solution contains Aromatic nitro compound 98.6%, Lead acetate (Pb(CH3CO2)2.3H2O) 0.9%, Thionic compound 0.5% used to dissolve gold stuck on tank walls | XXXXXXXXXX | 30 | KGM | 989.118 | Japan | NA |