3/31/2024 | 38249999 | -#&Metal plating salt solution FCE-200A. TP:Potassium Peroxymonosulfate Sulfate <30% CAS 70693-62-8, Sulfuric Acid <5% CAS 7664-93-9, Sodium Persulfate <3% CAS 7775-27-1. 100% new#&KR | XXXXXXXXXX | 1600 | LTR | 4164.16 | South Korea | NA |
3/31/2024 | 38249999 | -#&FCE-200 metal plating salt solution. TP: Potassium Peroxymonosulfate Sulfate <25% CAS 70693-62-8,Sulfuric Acid <5% CAS 7664-93-9,Sodium Persulfate <2% CAS 7775-27-1.NSX SY Co., Ltd. 100% new.#&KR | XXXXXXXXXX | 1280 | LTR | 2894.464 | South Korea | NA |
3/31/2024 | 38249999 | -#&Metal plating solution - ATNI - A, ingredients include: Nickel sulfate 0.3%, Sodium allysulfonate 0.9% and Water (remaining). 100% new product #&KR | XXXXXXXXXX | 100 | LTR | 1109.31 | South Korea | NA |
3/30/2024 | 38249999 | 0#&Copper plating additive HVF EL-CU A H1 contains Sulfuric Acid 3+/- 2%, Copper(II) sulfate 15 +/-5%, nickel sulfate, hexahydrate <1%, the rest is water. 20L/can. 100% new product | XXXXXXXXXX | 940 | LTR | 2769.24 | South Korea | NA |
3/30/2024 | 38249999 | 0#&Chemical catalyst CF 300 ACTIVATOR contains Sulfuric acid 5+/-4%, Palladium II sulfate 1+/-0.9%, the rest is water, 20l/can. 100% new product | XXXXXXXXXX | 140 | LTR | 6183.1 | South Korea | NA |
3/30/2024 | 38249999 | 0#&NRE-200A corrosive solution, PCB surface treatment, TP: Polyethylene glycol 5 ~ 10 %, Sulfuric acid 3 ~ 6 %, Water 74 ~ 82 %, Alkylammonium sulfate 10 % 100% brand new | XXXXXXXXXX | 5120 | LTR | 18899.456 | South Korea | NA |
3/30/2024 | 38249999 | 0#&Chemical catalyst CF 300 ACTIVATOR contains Sulfuric acid 5+/-4%, Palladium II sulfate 1+/-0.9%, the rest is water, 20l/can. 100% new product | XXXXXXXXXX | 320 | LTR | 13177.472 | South Korea | NA |
3/30/2024 | 3824999990 | Oxygen absorber package used in the packaging of finished products, ingredients Silica hydrate (30%); SODIUM BICARBONATE (9%); Sodium D-isoascorbate (30%),Water (30%),Ferrous Sulfate, Heptahydrate (1%),130g/package,#&CN | XXXXXXXXXX | 67200 | PCE | 44560.32 | VIETNAM | NA |
3/30/2024 | 38249999 | The chemical mixture has basic ingredients of Nickel sulfate and Nickel chloride Ni-1850Ni. (CTHH: NiSO4 (CAS: 10101-97-0) and NiCl2 (CAS: 7791-20-0), used for electroplating) | XXXXXXXXXX | 990 | KGM | 12384.9 | Japan | NA |
3/30/2024 | 38249999 | 0#&HVF EL-CU M H2: Copper plating additive contains Sodium hydroxide 10+/-2%, nickel sulfate, hexahydrate 0.5+/-0.4%, the rest is water. 20l/can. 100% New | XXXXXXXXXX | 640 | LTR | 2990.656 | South Korea | NA |