3/30/2024 | 85423900 | SW3016685#&Integrated semiconductor components (microchip coupled to transmit and receive signals, capacity 29dBm) | XXXXXXXXXX | 3000 | PCE | 487.8 | Japan | NA |
3/30/2024 | 85423900 | SW3016685#&Integrated semiconductor components (microchip coupled to transmit and receive signals, capacity 29dBm) | XXXXXXXXXX | 15000 | PCE | 2439 | Japan | NA |
3/30/2024 | 85423900 | SW3016685#&Integrated semiconductor components (microchip coupled to transmit and receive signals, capacity 29dBm) | XXXXXXXXXX | 9000 | PCE | 1463.4 | Japan | NA |
3/30/2024 | 85423900 | SW3016299#&Integrated semiconductor components (microchip coupled to transmit and receive signals, voltage 3V) | XXXXXXXXXX | 3000 | PCE | 555.6 | Japan | NA |
3/30/2024 | 85423900 | SW3016299#&Integrated semiconductor components (microchip coupled to transmit and receive signals, voltage 3V) | XXXXXXXXXX | 12000 | PCE | 2222.4 | Japan | NA |
3/30/2024 | 85423900 | SW3016299#&Integrated semiconductor components (microchip coupled to transmit and receive signals, voltage 3V) | XXXXXXXXXX | 6000 | PCE | 1111.2 | Japan | NA |
3/30/2024 | 85423900 | SW3016685#&Integrated semiconductor components (microchip coupled to transmit and receive signals, capacity 29dBm) | XXXXXXXXXX | 21000 | PCE | 3414.6 | Japan | NA |
3/30/2024 | 85423900 | SW3016685#&Integrated semiconductor components (microchip coupled to transmit and receive signals, capacity 29dBm) | XXXXXXXXXX | 9000 | PCE | 1463.4 | Japan | NA |
3/29/2024 | 85423900 | SW3016302#&Integrated semiconductor components (microchip coupled to transmit and receive signals, capacity 29dBm) | XXXXXXXXXX | 9000 | PCE | 1890.9 | Japan | NA |
3/27/2024 | 85423900 | VM01#&Microchip for mobile phone camera circuit board HALL IC(HG-0A14) | XXXXXXXXXX | 200000 | PCE | 12640 | Japan | NA |