3/30/2024 | 38101000 | NW266#&Cream solder tin (lead-free SAC305 INDIUM8.9HF; material: 1.Tin (Sn) 80.1-88.8%;2.Silver (Ag) 2.5-2.8%;3.Copper (Cu) 0.42- 0.46%;...;),911-0R10-023 | XXXXXXXXXX | 50 | KGM | 5950 | Singapore | NA |
3/30/2024 | 38101000 | KHT#&CLEAN SOLDER CREAM NP303 COSMO ZQ-C 500G solder paste, for soldering components onto electronic circuit boards, TP: Sn(7440-31-5),AG(7440-22-4), CU(7440-50 -8), 100% New. (Item 4.5 TK 105683516150).Code 2103ZZS00001 | XXXXXXXXXX | 20 | KGM | 1730 | Malaysia | NA |
3/29/2024 | 38101000 | CREAM#&Solder paste-M01010007A-SOLDER-TLF-204-GTS-VR1;96.5Sn3.0Ag0.5Cu;6;A 100% new | XXXXXXXXXX | 10 | KGM | 1046.48 | South Korea | NA |
3/29/2024 | 38101000 | LXVTC35#&ALPHA OM550 HRL1 cream solder tin, 500g/bottle (CAS TP: 7440-69-9,7440-31-5,144413-22-9,65997-06-0,112-59-4) 230-200020-550RH .new 100% | XXXXXXXXXX | 30000 | GRM | 3237 | Hong Kong | NA |
3/29/2024 | 38101000 | CREAM#&Solder paste-M01010006A-SOLDER-M705-GRN360-K2-V;96.5SN3.0AG0.5CU;4;A 100% new | XXXXXXXXXX | 200 | KGM | 14710.8 | South Korea | NA |
3/29/2024 | 38101000 | BLV-TL-223#&Solder cream used as solder flux OM340SL ingredient 96.5SN/3.0AG/0.5CU (500gr/1 bottle). New 100% | XXXXXXXXXX | 5000 | GRM | 483.5 | Singapore | NA |
3/29/2024 | 38101000 | Tin paste (solder paste) in cream form, used to solder components for electronic assembly production, model GM2-910-VH. New 100% | XXXXXXXXXX | 100 | KGM | 3695 | China | NA |
3/29/2024 | 38101000 | M4000873#&Solder (cream) SHF M705-NHS1-T6M(SKMXZAEJ0640BS020G)#CV | XXXXXXXXXX | 420 | GRM | 136.5 | Japan | NA |
3/28/2024 | 38101000 | 0202-002253#&TIN CREAM | XXXXXXXXXX | 1200000 | GRM | 88320 | South Korea | NA |
3/28/2024 | 38101000 | SOLDER#&Cream used for gas welding (Consumables) LFSOLDER GP-211-NH(DG) 0.5kg/can/pce (100pce) (News: 84.4%) 100095221/7810063000. 100% New | XXXXXXXXXX | 100 | PCE | 2505 | China | NA |