3/29/2024 | 3824999910 | Ultra-fine white marble powder coated with AB-CARB-CC7 Stearic Acid. Particle size (D97) < 1 mm, whiteness > 90% according to KQPT: 545/2024/THG-GL dated March 27, 2024. Chau Quang mine, THNA KT KS&TM, CB THNA GROUP#&VN | XXXXXXXXXX | 28 | TNE | 2223.55 | VIETNAM | NA |
3/29/2024 | 3824999910 | Ultra-fine white marble powder coated with AB-CARB-CC5 Stearic Acid. Particle size (D97) < 1 mm, whiteness > 90% according to KQPT: 546/2024/THG-GL dated March 27, 2024. Chau Quang mine, THNA KT KS&TM, CB THNA GROUP#&VN | XXXXXXXXXX | 28 | TNE | 2330.4512 | VIETNAM | NA |
3/29/2024 | 38249999 | FK047#&THERM-A-GAP(TM) GEL AB thermal paste, including: Aluminum oxide (1344-28-1) 80-100%, Dimethylmethylvinylsiloxane (67762-94-1) 5-10%, Carbon black (1333- 86-4) 0.1-0.5%,946-08838-PA-W | XXXXXXXXXX | 67.95 | KGM | 5134.302 | USA | NA |
3/29/2024 | 3824999990 | Uncoated EFPP 1001-TM additive granule, size 3x3mm, is a product consisting of calcium carbonate (70-90%) dispersed in primary plastic and additives (10-30%), 100% new product#&VN | XXXXXXXXXX | 10000 | KGM | 2921 | VIETNAM | NA |
3/28/2024 | 38249999 | 07020329#&Copper Gleam (TM) solution HS-200B-1 (J) used in plating contains Copper Sulphate0.1-1%,Oxyalkylene Polymer15-25%,Sulfuric acid0.1-1% and water75-85% used in Electronic industry - 20L/T | XXXXXXXXXX | 100 | LTR | 1325 | Japan | NA |
3/28/2024 | 38249999 | 07020124#&Microfill(TM) EVF-C2 solution contains Sulfuric acid(H2SO4) 0.1-1%, Copper sulfate(CuSO4) 0.1-1%, Formaldehyde(CH2O) 0.1-1%, Polyalkyleneglycol used in Plating industry-20L/T.100% New | XXXXXXXXXX | 400 | LTR | 8352 | Japan | NA |
3/28/2024 | 38249999 | 07020802#&Circuposit cleaning product (TM)MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10%-20L/T.100% New | XXXXXXXXXX | 500 | LTR | 4550 | Taiwan | NA |
3/28/2024 | 38249999 | 73302023#&Additive product in electroplating Copper Gleam(TM)ST-901BM(J) helps prevent copper plating on the convex surface of the circuit board, including 7732-18-5(80-90%),OxyalkylenePolymer(1-10% ),7758-98-7(0.1-1%),7664-93-9(<1%)new100% | XXXXXXXXXX | 1400 | LTR | 0.7 | Japan | NA |
3/28/2024 | 38249999 | 07020308#&Water mixture 50-60%; Tetrasodium salt of ethylenediamine-tetraacetic acid 30-40%; Propoxylated amine<1% used in plating industry - cuposit TM 253E electroless copper-20L/T.100% new | XXXXXXXXXX | 200 | LTR | 1020 | Taiwan | NA |
3/28/2024 | 38249999 | 07020124#&Microfill(TM) EVF-C2 solution contains Sulfuric acid(H2SO4) 0.1-1%, Copper sulfate(CuSO4) 0.1-1%, Formaldehyde(CH2O) 0.1-1%, Polyalkyleneglycol used in Plating industry-20L/T.100% New | XXXXXXXXXX | 200 | LTR | 4176 | Japan | NA |