Get Latest Vietnam Import Data of Mak tm mak under HS Code 38249999

Discover latest Vietnam shipment data of Mak tm mak under HS code 38249999. Find Product description, Price, buyer, supplier name, Port & shipping information. Ultilize these valuable insights for implementing successful marketing strategy. Scale your Business with our authentic Vietnam Import Data.


DATEHS CODEPRODUCT DESCRIPTIONEXPORTERQUANTITYUNITTOTAL VALUE USDORIGIN COUNTRYPORT OF UNLOADING
3/29/20243824999910Ultra-fine white marble powder coated with AB-CARB-CC7 Stearic Acid. Particle size (D97) < 1 mm, whiteness > 90% according to KQPT: 545/2024/THG-GL dated March 27, 2024. Chau Quang mine, THNA KT KS&TM, CB THNA GROUP#&VNXXXXXXXXXX28TNE2223.55VIETNAMNA
3/29/20243824999910Ultra-fine white marble powder coated with AB-CARB-CC5 Stearic Acid. Particle size (D97) < 1 mm, whiteness > 90% according to KQPT: 546/2024/THG-GL dated March 27, 2024. Chau Quang mine, THNA KT KS&TM, CB THNA GROUP#&VNXXXXXXXXXX28TNE2330.4512VIETNAMNA
3/29/202438249999FK047#&THERM-A-GAP(TM) GEL AB thermal paste, including: Aluminum oxide (1344-28-1) 80-100%, Dimethylmethylvinylsiloxane (67762-94-1) 5-10%, Carbon black (1333- 86-4) 0.1-0.5%,946-08838-PA-WXXXXXXXXXX67.95KGM5134.302USANA
3/29/20243824999990Uncoated EFPP 1001-TM additive granule, size 3x3mm, is a product consisting of calcium carbonate (70-90%) dispersed in primary plastic and additives (10-30%), 100% new product#&VNXXXXXXXXXX10000KGM2921VIETNAMNA
3/28/20243824999907020329#&Copper Gleam (TM) solution HS-200B-1 (J) used in plating contains Copper Sulphate0.1-1%,Oxyalkylene Polymer15-25%,Sulfuric acid0.1-1% and water75-85% used in Electronic industry - 20L/TXXXXXXXXXX100LTR1325JapanNA
3/28/20243824999907020124#&Microfill(TM) EVF-C2 solution contains Sulfuric acid(H2SO4) 0.1-1%, Copper sulfate(CuSO4) 0.1-1%, Formaldehyde(CH2O) 0.1-1%, Polyalkyleneglycol used in Plating industry-20L/T.100% NewXXXXXXXXXX400LTR8352JapanNA
3/28/20243824999907020802#&Circuposit cleaning product (TM)MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10%-20L/T.100% NewXXXXXXXXXX500LTR4550TaiwanNA
3/28/20243824999973302023#&Additive product in electroplating Copper Gleam(TM)ST-901BM(J) helps prevent copper plating on the convex surface of the circuit board, including 7732-18-5(80-90%),OxyalkylenePolymer(1-10% ),7758-98-7(0.1-1%),7664-93-9(<1%)new100%XXXXXXXXXX1400LTR0.7JapanNA
3/28/20243824999907020308#&Water mixture 50-60%; Tetrasodium salt of ethylenediamine-tetraacetic acid 30-40%; Propoxylated amine<1% used in plating industry - cuposit TM 253E electroless copper-20L/T.100% newXXXXXXXXXX200LTR1020TaiwanNA
3/28/20243824999907020124#&Microfill(TM) EVF-C2 solution contains Sulfuric acid(H2SO4) 0.1-1%, Copper sulfate(CuSO4) 0.1-1%, Formaldehyde(CH2O) 0.1-1%, Polyalkyleneglycol used in Plating industry-20L/T.100% NewXXXXXXXXXX200LTR4176JapanNA

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