| 3/21/2024 | 39049090 | CNP03#&LCP (Liquid Crystal Polymer) resin used for molding and shaping semiconductor connector components LCP-LX70G35-BLK RESSIN code R-F138 | XXXXXXXXXX | 100000 | GRM | 910 | South Korea | NA |
| 3/14/2024 | 39049090 | CNP03#&LCP (Liquid Crystal Polymer) resin used for molding and shaping semiconductor connector components LCP-LX70G35-BLK RESSIN code R-F138 | XXXXXXXXXX | 400000 | GRM | 3640 | South Korea | NA |
| 3/14/2024 | 39049090 | CNP03#&LCP (Liquid Crystal Polymer) resin used for molding and shaping semiconductor connector components LCP-E471I-NAT RESSIN code R-F102 | XXXXXXXXXX | 300000 | GRM | 3750 | South Korea | NA |
| 3/14/2024 | 39049090 | CNP03#&LCP (Liquid Crystal Polymer) resin used for molding and shaping semiconductor connector components LCP-E473I-NAT RESSIN code R-F104 | XXXXXXXXXX | 400000 | GRM | 4920 | South Korea | NA |
| 3/14/2024 | 39049090 | CNP03#&LCP (Liquid Crystal Polymer) resin used for molding and shaping semiconductor connector components LCP-GA130-BLK RESSIN code R-F127 | XXXXXXXXXX | 1000000 | GRM | 11700 | South Korea | NA |
| 3/14/2024 | 39049090 | CNP03#&LCP (Liquid Crystal Polymer) resin used for molding and shaping semiconductor connector components LCP-E473I-BLK RESSIN code R-F105 | XXXXXXXXXX | 300000 | GRM | 3690 | South Korea | NA |
| 3/13/2024 | 39049090 | E-130I#&Plastic granules for processing camera components (ingredients: Aromatic Liquid Crystal Polymer (LCP): 68%, Glass fiber: 30%, carbon black: 1%, others: 1%) | XXXXXXXXXX | 100 | KGM | 50.77 | Japan | NA |
| 3/13/2024 | 39049090 | E-130IR1#&Plastic granules for processing camera components (ingredients: Aromatic Liquid Crystal Polymer (LCP): 68%, Glass fiber: 30%, carbon black: 1%, others: 1%) | XXXXXXXXXX | 25 | KGM | 12.6925 | Japan | NA |
| 2/17/2024 | 39049090 | CNP03#&LCP (Liquid Crystal Polymer) resin used for molding and shaping semiconductor connector components LCP-E473I-BLK RESSIN code R-F105 | XXXXXXXXXX | 500000 | GRM | 6150 | South Korea | NA |
| 2/17/2024 | 39049090 | CNP03#&LCP (Liquid Crystal Polymer) resin used for molding and shaping semiconductor connector components LCP-KH230NM-NAT RESSIN code R-F133 | XXXXXXXXXX | 500000 | GRM | 8750 | South Korea | NA |