| 3/30/2024 | 3824999990 | Oxygen absorber package used in packaging finished products, code OHX400, type 2000cc, TP Silicon dioxide CAS No. 112926-00-8; Manganese monosulfate CAS No. 7785-87-7, 16g/pack, 10 packs/blister, label: LIPMEN, 100% new#&KR | XXXXXXXXXX | 54000 | PCE | 47039.4 | VIETNAM | NA |
| 3/30/2024 | 3824999990 | Oxygen absorber package used in packaging finished products, code OHX400, type 2000cc, TP Silicon dioxide CAS No. 112926-00-8;Manganese monosulfate CAS No. 7785-87-7, 16g/pack, 10 packs/blister, manufacturer: LIPMEN, 100% new#&KR | XXXXXXXXXX | 10800 | PCE | 9029.88 | VIETNAM | NA |
| 3/29/2024 | 3824999990 | Moisture-proof granules, silicon dioxide content 62.87%; Aluminum oxide 17.7%; Ferric oxide 7.73%; Magnesium oxide 5.29%; Calcium oxide 3.39%; Sodium oxide 1.22%,Potassium oxide 1.80%,7511318. 100% new#&VN | XXXXXXXXXX | 1002 | PCE | 330.66 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | Copper plating solution supplement CU AD-1000 (1KG/CAN) (Content: thiourea 0.5%, SODIUM SACCHARIN 0.5%, Water 99%). 100% new product #&KR | XXXXXXXXXX | 10 | KGM | 399.2 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | Additive solution for copper electrolysis ELC-MPS-B (new);tp:Ethylenediaminetetraaceticacid tetrasodium salt<40%;Tetrakis(2-hydroxypropyl)-ethylenediamine<8%, water > 51%. 20 liters/barrel#&VN | XXXXXXXXXX | 200 | LTR | 491.68 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | Chemical SiO2 (Silic dioxide) 1-2 mm particles. Main ingredient is: Silicon dioxide (99.98%), CAS number: 7631-86-9. Used to coat phone screens and other devices. Manufacturer :DON CO., LTD.100% new item#&KR | XXXXXXXXXX | 1 | KGM | 14.2219 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | Additive solution for copper electrolysis ELC-MPS -C, ingredients: Sodium Hydroxide (<30%), Ethylenediaminetetraaceticacid disodium salt (<2%) 20 liters/barrel#&VN | XXXXXXXXXX | 4800 | LTR | 5656.32 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | Additive for alloy plating (Ni-P)ENF-M, used in plating industry, liquid form, 20L/can; TP: Sodium hypophosphite monohydrate 20-25%, Ammonium hydroxide Solution 15-20%, Lactic acid 10 -15%,Malic acid 5-10%#&VN | XXXXXXXXXX | 1300 | LTR | 4965.48 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | Additive solution for copper electrolysis ELC-MPS-B;tp:Ethylenediaminetetraaceticacid tetrasodium salt<15%;Triethanolamine<5%;Tetrakis(2-hydroxypropyl)-ethylenediamine<35%, water > 45. 20 liters/barrel#&VN | XXXXXXXXXX | 2900 | LTR | 7129.36 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | Additive for alloy plating (Ni-P) ENF-B, used in plating industry, liquid form, 20L/can; TP: Sodium hypophosphite monohydrate 45-55%, Ammonium hydroxide Solution 1-2%. 100% new#&VN | XXXXXXXXXX | 1600 | LTR | 7151.52 | VIETNAM | NA |