| 3/28/2024 | 38101000 | FY097#&Lead-free solder, INDIUM 8.9HF1 includes: TIN (Sn) 85.9-88.8%(7440-31-5), SILVER (Ag) 2.67-2.76%(7440- 22-4), COPPER (Cu) 0.45-0.46%(7440-50-8),,...5C0302200-HU5-G | XXXXXXXXXX | 200 | KGM | 21798 | Malaysia | NA |
| 3/28/2024 | 38101000 | FY097#&Lead-free solder, INDIUM 8.9HF1 includes: TIN (Sn) 85.9-88.8%(7440-31-5), SILVER (Ag) 2.67-2.76%(7440- 22-4), COPPER (Cu) 0.45-0.46%(7440-50-8),),...5C0302200-HU5-G | XXXXXXXXXX | 200 | KGM | 21798 | Malaysia | NA |
| 3/26/2024 | 38101000 | FN023#&Solder paste (Indium 8.9HFG Solder Paste includes: 1.Tin 80.1-88.8%(7440-31-5),2.Silver 2.5-2.8%(7440-22-4),3.Copper 0.42-0.46%( 7440-50-8),4.Rosin 4-6%(65997-05-9),...),G160-00795-00 | XXXXXXXXXX | 250 | KGM | 26417.5 | Malaysia | NA |
| 3/25/2024 | 38101000 | FY097#&Lead-free solder, INDIUM 8.9HF1 includes: TIN (Sn) 85.9-88.8%(7440-31-5), SILVER (Ag) 2.67-2.76%(7440- 22-4), COPPER (Cu) 0.45-0.46%(7440-50-8),...5C0302200-HU5-G | XXXXXXXXXX | 100 | KGM | 10899 | Malaysia | NA |
| 3/25/2024 | 38101000 | FN023#&Solder (Indium 8.9HF includes: Tin 80.1-88.8%(7440-31-5),Silver 2.5-2.8%(7440-22-4),Copper 0.42-0.46%(7440-50-8),Rosin 4-6%(65997-05-9),POLYGLYCOL ETHER 2.5-4%(9038-95-3),...),SPE-FN-44 | XXXXXXXXXX | 200 | KGM | 20314 | Malaysia | NA |
| 3/23/2024 | 38109000 | FY179#&Lead-free tin cream (Indium 8.9HFA includes:1.Tin:80.1-88.8% (7440-31-5),2.Silver 2.5-2.8% (7440-22-4),3.Copper 0.42 -0.46% (7440-50-8),4.rosin 4-7%(65997-05-9),...,5C0303600-HU5-G | XXXXXXXXXX | 98 | KGM | 9738.26 | Malaysia | NA |
| 3/22/2024 | 38101000 | 86020000Z00#&Solder paste, SOLDPASTE INDIUM8.9HFG T5C(G) INDIUM AA8G160-01182-00/01, PN:86020000Z00, 100% new | XXXXXXXXXX | 100000 | GRM | 11670 | Malaysia | NA |
| 3/22/2024 | 38101000 | 86020001100#&Solder paste, SOLDPASTE INDIUM8.9HFG T5C(G) INDIUM AA8G160-01182-00/01, PN:86020001100, 100% new product | XXXXXXXXXX | 8500 | GRM | 1072.7 | Malaysia | NA |
| 3/21/2024 | 38101000 | Solder paste - Solder paste, code PASTEOT-800495, used to solder in electronic components, manufacturer: INDIUM CORPORATION, packaged 500g/bottle, 100% new | XXXXXXXXXX | 50 | KGM | 6082.3 | Malaysia | NA |
| 3/20/2024 | 38101000 | Paste solder paste PASTEOT-803079, SAC305 INDIUM 10.8HF TYPE 5-MC 87.75%, 500G/Box, used to solder electronic components, Nsx:INDIUM CORPORATION (MALAYSIA) SDN.BHD, 100% new | XXXXXXXXXX | 200 | KGM | 36735.8 | Malaysia | NA |