| 3/26/2024 | 38249999 | 07020131#&MICROFILL THF LEVELER SOLUTION(TM) containing 90-99% Water, Sulfuric Acid < 1.0%, Copper sulfate < 1.0%, Imidazole polymer < 1.0% used in electroplating technology-20L/T.New 100 % | XXXXXXXXXX | 80 | LTR | 5855.2 | Taiwan | NA |
| 3/12/2024 | 38249999 | 07020131#&MICROFILL THF LEVELER SOLUTION(TM) contains Water 90-99%, Sulfuric Acid < 1.0%, Copper sulfate < 1.0%, Imidazole polymer < 1.0% used in electroplating technology | XXXXXXXXXX | 100 | LTR | 7319 | Taiwan | NA |
| 3/8/2024 | 38249999 | METAL SURFACE ADDITIVE CR-72A-Chemical preparation used in plating, containing glycine, imidazole and additives in aqueous medium, liquid form.(1012/KD3, August 14, 2020) | XXXXXXXXXX | 450 | LTR | 6126.615 | Taiwan | NA |
| 3/8/2024 | 38249999 | METAL SURFACE ADDITIVE CR-72B - Chemical preparation used in plating, containing glycine, imidazole and additives in aqueous medium, liquid form. (1012/KD3, August 14, 2020) | XXXXXXXXXX | 275 | LTR | 4212.065 | Taiwan | NA |
| 2/16/2024 | 38249999 | MICROFILL THF LEVELER SOLUTION contains Water 90-99%, Sulfuric Acid < 1.0%, Copper sulfate < 1.0%, Imidazole polymer < 1.0% used in electroplating technology, 100% new | XXXXXXXXXX | 400 | LTR | 17357.72 | Taiwan | NA |
| 2/6/2024 | 38249999 | 07020131#&MICROFILL THF LEVELER SOLUTION(TM) containing 90-99% Water, Sulfuric Acid < 1.0%, Copper sulfate < 1.0%, Imidazole polymer < 1.0% used in electroplating technology-20L/T.New 100 % | XXXXXXXXXX | 100 | LTR | 7319 | Taiwan | NA |
| 1/17/2024 | 38249999 | 07020131#&MICROFILL THF LEVELER SOLUTION(TM) contains Water 90-99%, Sulfuric Acid < 1.0%, Copper sulfate < 1.0%, Imidazole polymer < 1.0% used in electroplating technology | XXXXXXXXXX | 100 | Liter | 7319 | Taiwan | NA |
| 1/11/2024 | 38249999 | METAL SURFACE ADDITIVE CR-72B - Chemical preparation used in plating, containing glycine, imidazole and additives in aqueous medium, liquid form. (1012/KD3, August 14, 2020) | XXXXXXXXXX | 75 | Liter | 1147.5 | Taiwan | NA |
| 1/11/2024 | 38249999 | METAL SURFACE ADDITIVE CR-72A-Chemical preparation used in plating, containing glycine, imidazole and additives in aqueous medium, liquid form.(1012/KD3, August 14, 2020) | XXXXXXXXXX | 125 | Liter | 1700 | Taiwan | NA |
| 1/8/2024 | 38249999 | 07020131#&MICROFILL THF LEVELER SOLUTION(TM) solution containing 90-99% Water, Sulfuric Acid < 1.0%, Copper sulfate < 1.0%, Imidazole polymer < 1.0% used in electroplating technology-20L/T.New 100 % | XXXXXXXXXX | 200 | Liter | 14638 | Taiwan | NA |