3/23/2024 | 38109000 | MTV23-03#&Soldering flux (Ingredients: Denatured acid hydrogenation rosin, organic acid modified rosin, 2-(2-Hexyloxyethoxy)ethanol, wax, organic acid). New 100% | XXXXXXXXXX | 10 | PCE | 371 | Japan | NA |
3/19/2024 | 38109000 | FUH276#&Lead-free tin cream, S01XBIG58-M500-4,Tin 82-88%, Copper 0.1-1%,bismuth 1-2%, Denatured acid hydrogenation rosin 3-5%, 2-(2-Hexyloxyethoxy) ethanol 3-5%,...,591,00068,005 | XXXXXXXXXX | 600 | KGM | 34758 | Japan | NA |
3/19/2024 | 38109000 | FUH276#&Lead-free tin cream, S3X58-M500,Tin:82-88%;Silver 2-3%; Copper 0.1-1%;Denatured acid hydrogenation rosin 3-5%; 2-(2-Hexyloxyethoxy)ethanol 3-5%;Dimer acid 1-3%,5C0302100-633-G | XXXXXXXXXX | 150 | KGM | 11194.5 | Japan | NA |
3/5/2024 | 38101000 | 86030006500#&KOKI TF-MP2 Soldering Paste, 100g/Bottle (TP: Denatured acid hydrogenation rosin, 2-(2-Hexyloxyethoxy) ethanol,...) used to connect components to electronic circuit boards, PN: 86030006500. New 100% | XXXXXXXXXX | 1600 | GRM | 4000 | Japan | NA |
3/1/2024 | 38101000 | Soldering paste TF-MP2, 100g/Bottle (TP: Denatured acid hydrogenation rosin, 2-(2-Hexyloxyethoxy) ethanol,...) used to connect components to electronic circuit boards. New 100% | XXXXXXXXXX | 1.6 | KGM | 1024 | Japan | NA |
2/29/2024 | 38109000 | MTV23-03#&Soldering flux (Ingredients: Denatured acid hydrogenation rosin, organic acid modified rosin, 2-(2-Hexyloxyethoxy)ethanol, wax, organic acid). New 100% | XXXXXXXXXX | 10 | PCE | 371 | Japan | NA |
2/26/2024 | 38109000 | FUH276#&Lead-free solder paste, S3X58-M500,Tin:82-88%;Silver 2-3%; Copper 0.1-1%;Denatured acid hydrogenation rosin 3-5%; 2-(2-Hexyloxyethoxy)ethanol 3-5%;Dimer acid 1-3%,591.00046.005 | XXXXXXXXXX | 16 | KGM | 1194.08 | Japan | NA |
2/26/2024 | 38109000 | FUH276#&Lead-free solder paste, S01XBIG58-M500-4,Tin 82-88%, Copper 0.1-1%,bismuth 1-2%, Denatured acid hydrogenation rosin 3-5%, 2-(2-Hexyloxyethoxy) ethanol 3-5%,....,591,00068,005 | XXXXXXXXXX | 400 | KGM | 23172 | Japan | NA |
2/5/2024 | 38101000 | CA00300002#&Solder paste S3X58-M650-3 contains Tin 82-88%,Silver 2-3%,Copper 0.1-1%,2-(2-Hexyloxyethoxy)ethanol 2-4%,Diglyceryl tetraisostearate 1-3% (Sn, Ag, Cu, C10H22O3)(500g/JAR) | XXXXXXXXXX | 10 | KGM | 1060.562 | Japan | NA |
1/31/2024 | 38109000 | FUH276#&Lead-free solder paste, S3X58-M500,Tin:82-88%;Silver 2-3%; Copper 0.1-1%;Denatured acid hydrogenation rosin 3-5%; 2-(2-Hexyloxyethoxy)ethanol 3-5%;Dimer acid 1-3%,5C0302100-633-G | XXXXXXXXXX | 150 | Kilograms | 11194.5 | Japan | NA |