3/26/2024 | 38101000 | KEMHAN#&Solder paste S3X48-M500 (0.5kg/tube (Tin(7440-31-5),Silver(7440-22-4 ),Copper(7440-50-8 ),Denatured acid hydrogenation rosint,2-(2- Hexyloxyethoxy)ethanol(112-59-4),Dimer acid). | XXXXXXXXXX | 10 | UNA | 490.91 | South Korea | NA |
3/25/2024 | 38109000 | 322000500269 Soldering flux Alpha OM 550 (247240) 30G/PCS, TP: Proprietary Rosin/Resin 10-20%, Glycol Ether 10-20%, 2-(2-hexyloxyethoxy)ethanol 10-20%, Petrolatum 1-10% . 100% new product #&CN | XXXXXXXXXX | 780 | GRM | 624 | VIETNAM | NA |
3/23/2024 | 38109000 | MTV23-03#&Soldering flux (Ingredients: Denatured acid hydrogenation rosin, organic acid modified rosin, 2-(2-Hexyloxyethoxy)ethanol, wax, organic acid). New 100% | XXXXXXXXXX | 10 | PCE | 371 | Japan | NA |
3/19/2024 | 38109000 | FUH276#&Lead-free tin cream, S01XBIG58-M500-4,Tin 82-88%, Copper 0.1-1%,bismuth 1-2%, Denatured acid hydrogenation rosin 3-5%, 2-(2-Hexyloxyethoxy) ethanol 3-5%,...,591,00068,005 | XXXXXXXXXX | 600 | KGM | 34758 | Japan | NA |
3/19/2024 | 38109000 | FUH276#&Lead-free tin cream, S3X58-M500,Tin:82-88%;Silver 2-3%; Copper 0.1-1%;Denatured acid hydrogenation rosin 3-5%; 2-(2-Hexyloxyethoxy)ethanol 3-5%;Dimer acid 1-3%,5C0302100-633-G | XXXXXXXXXX | 150 | KGM | 11194.5 | Japan | NA |
3/18/2024 | 38109000 | V2M06000H01#&Solder flux LS10 (100g/bottle), cream form, TP: Proprietary Rosin/Resin >10%,Glycol Ether 10-20%, 2-(2-hexyloxyethoxy)ethanol 10-20%,Petrolatum 1-10% , used for soldering in electronics production, 100% new | XXXXXXXXXX | 26 | UNA | 419.731 | China | NA |
3/16/2024 | 38109000 | Soldering flux LS10, V2M06000H01, (100g/bottle), Ingredients: Proprietary Rosin/Resin >10%, Glycol Ether 10-20%, 2-(2-hexyloxyethoxy)ethanol 10-20%..., used for internal soldering Electronic production, 100% new#&CN | XXXXXXXXXX | 26 | UNA | 419.731 | VIETNAM | NA |
3/14/2024 | 38109000 | Soldering flux EF8000 (20 liters/barrel), TP: Proprietary Rosin/Resin 10-20%, Glycol Ether 10-20%, 2-(2-hexyloxyethoxy)ethanol 10-20%, Petrolatum 1-10% | XXXXXXXXXX | 200 | LTR | 1414 | China | NA |
3/5/2024 | 38101000 | 86030006500#&KOKI TF-MP2 Soldering Paste, 100g/Bottle (TP: Denatured acid hydrogenation rosin, 2-(2-Hexyloxyethoxy) ethanol,...) used to connect components to electronic circuit boards, PN: 86030006500. New 100% | XXXXXXXXXX | 1600 | GRM | 4000 | Japan | NA |
3/4/2024 | 38101000 | Soldering flux in paste form OM525 SBX02 ingredients: bismuth, tin, 2-(2-hexyloxyethoxy)ethanol... used in soldering (500gr/1 bottle). 100% new product (Line 02 Account 106036310330) | XXXXXXXXXX | 10 | KGM | 962.335 | Singapore | NA |