| 3/29/2024 | 38101000 | 0#&RONACLEAN EVP-221C CLEANER:Glycolic acid 5-15%,Poly(oxy-1,2-ethanediyl), .alpha.-[3,5-dimethyl-1-(2-methylpropyl)hexyl]-.omega. -hydroxy 1-10%, Ethylene glycol monobutyl ether 1-5% for PCB production | XXXXXXXXXX | 500 | LTR | 4700 | Taiwan | NA |
| 3/28/2024 | 38101000 | AL-DST metal surface treatment agent, liquid, 20L/can; TP: Ammonium Fluoride 25-35%, Hydrogen peroxide 30-40%; 100% new product#&VN | XXXXXXXXXX | 4760 | LTR | 8340.948 | VIETNAM | NA |
| 3/28/2024 | 38101000 | CM-00346#&RONACLEAN EVP-221C CLEANER solution used in copper plating process (Glycolic acid 5-15%, Poly(oxy-1,2-ethanediyl), alpha.-[3,5-dimethyl-1-(2 -methylpropyl)hexyl]-omega-hydroxy 1-10%,...) | XXXXXXXXXX | 60 | LTR | 493.8 | Taiwan | NA |
| 3/25/2024 | 38101000 | 07020853#&RONACLEAN EVP-221C CLEANER:Glycolic acid5-15%,Poly(oxy-1,2-ethanediyl), .alpha.-[3,5-dimethyl-1-(2-methylpropyl)hexyl]-.omega.- hydroxy1-10%,Ethylene glycol monobutyl ether1-5%-20L/T | XXXXXXXXXX | 200 | LTR | 1880 | Taiwan | NA |
| 3/22/2024 | 38101000 | AL-DST metal surface treatment agent, liquid, 20L/can; TP: Ammonium Fluoride 25-35%, Hydrogen peroxide 30-40%; 100% new product#&VN | XXXXXXXXXX | 640 | LTR | 1125.12 | VIETNAM | NA |
| 3/21/2024 | 38101000 | Z0000001-899538#&Acid-containing metal surface cleaning preparation (DIA BRIGHT #1000)(T/P: Methane Sulfonic Acid,Hydrogen peroxide,EDTA-2Na,Sodium Fluoride,Sodium Oxalate,Water),1000KG/Barrel. 100% new#&KR | XXXXXXXXXX | 4 | PAIL | 8642.4 | VIETNAM | NA |
| 3/21/2024 | 38101000 | The product helps brighten the copper plating surface based on Acid MELPOLISH COPPER 58 (25KG/can) (TP: Phosphoric acid 60-70%, NITRIC ACID 1-10%, HYDROGEN CHLORIDE 0.2%, WATER). 100% new product.#&JP | XXXXXXXXXX | 100 | KGM | 1426.82 | Japan | NA |
| 3/21/2024 | 38101000 | Z0000001-772615#&Acid-containing metal surface cleaning preparation (DIA BRIGHT #1000)(T/P: Methane Sulfonic Acid,Hydrogen peroxide,EDTA-2Na,Sodium Fluoride,Sodium Oxalate,Water),230Kg/Barrel. 100% new#&KR | XXXXXXXXXX | 42 | PAIL | 20852.16 | VIETNAM | NA |
| 3/20/2024 | 38101000 | 07010165#&Corrosion chemical CLEAN ETCH CPB-38 contains Hydrogen peroxide (H2O2) 35% and Sulfuric acid (H2SO4)<5% used to corrode excess copper layer to clean electronic circuit boards (20Kg/CAN). 100% new | XXXXXXXXXX | 3200 | KGM | 12800 | Japan | NA |
| 3/20/2024 | 38101000 | Metal surface cleaning agent - ACT-70C, liquid form, used to produce car mirror heating panels, ingredients include hydrogen peroxide, sulfuric acid, water. Producer: Chemtech International. New 100% | XXXXXXXXXX | 1280 | KGM | 5504 | South Korea | NA |