| 3/30/2024 | 38101000 | K10010000203#&Senju S70G solder paste (K10010000203) (500g/bottle), TP: tin 80-90%, copper <1%, silver 1-3%, rosin 4-6%, used for soldering in electronics production. 100% new product #&CN | XXXXXXXXXX | 50000 | GRM | 4265 | China | NA |
| 3/29/2024 | 38101000 | .#&ECO SOLDER PASTE S70G-HF TYPE4 soldering paste (H130410009038), 500G/JAR, 500G/BOT, TP: tin 80-90%, copper <1%, silver 1-3%, rosin 4-6%, used for soldering in electronics manufacturing. New 100% | XXXXXXXXXX | 131500 | GRM | 12558.25 | China | NA |
| 3/29/2024 | 38101000 | ECO SOLDER PASTE S70G-HF TYPE4 soldering paste (H130410009038), 500G/JAR, 500G/ BOTTLE, TP: tin 80-90%, copper <1%, silver 1-3%, rosin 4-6%, used for soldering in electronics manufacturing. 100% new product #&CN | XXXXXXXXXX | 131500 | GRM | 12558.25 | VIETNAM | NA |
| 3/29/2024 | 38101000 | SOLDER PASTE S3X811-NT2 solder paste (250G), TP: Tin(75-80%); Silver(2-3%); Rosin, oligomers (2-4%), (1 box/250G). New 100%. | XXXXXXXXXX | 2 | UNK | 440 | Japan | NA |
| 3/29/2024 | 38101000 | Flux flux (KS-DPM-C2); Ingredients: (Rosin 40-45%; Phenoxyisopropanol 50-55%; Trade Secret<5%). New 100% | XXXXXXXXXX | 2 | UNK | 50 | South Korea | NA |
| 3/28/2024 | 38101000 | Solder paste LFM-48W NH(IMT) -A 11.5% for soldering electronic circuit boards, TP: Sn CAS 7440-31-5(85.40%), Ag CAS 7440-22-4(2.66%), Cu CAS 7440-50-8 (0.44%), Rosin 8050-09-7(5.75%),... | XXXXXXXXXX | 100 | KGM | 8373.51 | Japan | NA |
| 3/28/2024 | 38101000 | Senju S70G solder paste (K10010000203) (500g/bottle), TP: tin 80-90%, copper <1%, silver 1-3%, rosin 4-6%, used for soldering in electronics production. 100% new product #&CN | XXXXXXXXXX | 50000 | GRM | 4265 | VIETNAM | NA |
| 3/28/2024 | 38101000 | Paste Flux CVP-390, 1 bottle/150 grams, used in electric welding industry, TPC: Glycol Ether, Rosin/Resin, Organic acid, Corrosion inhibitor, manufacturer: Alpha Assembly Solutions Korea Limited, 100% new | XXXXXXXXXX | 40 | PCE | 1980.804 | South Korea | NA |
| 3/28/2024 | 38101000 | 322000503723#&Solder cream, used to solder electronic components, main ingredients: bismuth 40-50%, tin 40-50%, Rosin/Resin 1-10%, Glycol Ether 1-10%, Proprietary rosin 1-10%. .., 500g/pcs, nsx Alpha, 322000503723 | XXXXXXXXXX | 28000 | GRM | 3427.2 | China | NA |
| 3/28/2024 | 38101000 | Solder paste LFM-48U TM-HP(ST) 120gram/pc (Main ingredients: Sn 7440-31-5 (82.99%), Ag 7440-22-4 (2.58%), Cu 7440-50-8 (0.43 %),Rosin 7%..., used to solder electronic circuit boards, 100% new. | XXXXXXXXXX | 20 | PCE | 594.118 | Japan | NA |