| 3/30/2024 | 39073030 | 500120100080000#&Primary epoxide resin, has many uses EPOXY RESIN XN-1244 FR (1KG/CAN) | XXXXXXXXXX | 5 | KGM | 113.9905 | Japan | NA |
| 3/29/2024 | 39219090 | EMI SHIELD COATED SILVER FILM plastic film (SF-PC5900) used in the production of electronic circuit boards (Non-self-adhesive, non-porous, epoxy-coated, size 520mm*100M, roll form), 100% new | XXXXXXXXXX | 208 | MTR | 3536 | Japan | NA |
| 3/29/2024 | 39199099 | Thermal reactive adhesive tape, main ingredient epoxy resin and adhesive to support PCB circuit boards, roll form (D3510*500), size 0.5m, 100% new product | XXXXXXXXXX | 200 | MTK | 3258.44 | Japan | NA |
| 3/29/2024 | 70102000 | Glass cover bar 5.5x500x0.2t- Glass Epoxy Plate, NLCTSP under order number 5 TK105316136550/E31 dated March 13, 2023, in the fuse manufacturing industry | XXXXXXXXXX | 138 | TAM | 48.4656 | Japan | NA |
| 3/29/2024 | 35069900 | POXY#&Welding paste-M01020009A-BOND,COATING,EPOXY-TB2215D;EPOXY;A 100% new | XXXXXXXXXX | 4000 | GRM | 395.6 | Japan | NA |
| 3/29/2024 | 35069900 | POXY#&Welding paste-M01020009A-BOND,COATING,EPOXY-TB2215D;EPOXY;A 100% new | XXXXXXXXXX | 6000 | GRM | 593.4 | Japan | NA |
| 3/29/2024 | 39073030 | 500120100080000#&Primary epoxide resin, has many uses EPOXY RESIN XN-1244 FR (1KG/CAN) | XXXXXXXXXX | 3 | KGM | 68.3943 | Japan | NA |
| 3/29/2024 | 70191100 | 2500869 (ZZ14-X595) CSF3PE-936SD; GLASS FIBER;CHOPPED; EPOXY- Cut glass braid, 4mm long, PTPL kq: 1511/TB-KD4 (December 27, 2018); cas: 65997-17-3 | XXXXXXXXXX | 1500 | KGM | 2220 | Japan | NA |
| 3/29/2024 | 35069900 | SEV006#&HIBON-3520 adhesive (main ingredients: Liquid epoxy resin, Calcium carbonate). New 100% | XXXXXXXXXX | 1000 | GRM | 57.9 | Japan | NA |
| 3/29/2024 | 35069900 | Z0040#&Adhesive (Seal-glo NE7250H Bisphenol A type epoxy resin:20-30%,25068-38-6) | XXXXXXXXXX | 1000 | GRM | 410 | Japan | NA |