| 3/31/2024 | 35061000 | Epoxy silicone glue for tile installation, capacity: (400)ml, 400g/tube, brand: Lion King, 100% new. | XXXXXXXXXX | 1000 | KGM | 1250 | China | NA |
| 3/30/2024 | 35061000 | 3M Plastic Adhesive 4475 (148ml) Methyl Ethyl Ketone 78-93-3 (56-60%), VMCC Polymer 32650-26-3 (15-25%), Cyclohexane 110-82-7 (<1%), Heptane 142-82-5(<1%). 100% New | XXXXXXXXXX | 10 | PIP | 72.328 | USA | NA |
| 3/30/2024 | 35061000 | NW104#&Glue EW6710,903-0001-1381 : 2.Hardener 40%; 1.Resin epoxy 40%; 3.Filler 20%; 50ml/ TUYP | XXXXXXXXXX | 1.95 | KGM | 899.70075 | China | NA |
| 3/30/2024 | 35061000 | WEC0046#&Adhesive to hold components tightly on electronic circuit boards (2-component Epoxy Adhesive E-20HP, Henkel brand). New 100%. P/N: 80379190R1F . PO: 60000968 | XXXXXXXXXX | 500 | MLT | 237.4 | China | NA |
| 3/30/2024 | 35061000 | (106139982650/E11/2024-03-14)Adhesive from epoxy resin, used for manufacturing circuit boards of telecommunications equipment to transmit and receive data with wireless network connection for use in cars-IVIDIV(RAC34939201). 100% New | XXXXXXXXXX | 500 | GRM | 444.55 | South Korea | NA |
| 3/30/2024 | 35061000 | Glue K5206 (300ML/750G/Tube) manufacturer KAFUTER, TP: Liquid polysiloxane 20-30%, Methyl triethoxy silane 6-12%, Thermal powder 60-70%. 100% new product #&CN | XXXXXXXXXX | 56250 | GRM | 478.125 | VIETNAM | NA |
| 3/30/2024 | 35061000 | NW104#&Keo dán LX83,903-0002-1227, Methyl methacrylate 30-50%, Polystyrene-block-polybutadiene-block-polystyrene 20-40%, Methacrylic acid 3-10%, Silica glass 5-20%, 490ML/UNA | XXXXXXXXXX | 24.99 | KGM | 3687.24951 | China | NA |
| 3/30/2024 | 35061000 | NW104#&Keo dán JT6062,090-0100-311-V,Polyurethane acrylate 40-60%,Isobornyl acrylate, IBOA 15-30%,N,N-Diethyl acrylamide DEAA 15-30%,Methyl-4'-(methylthio)-2-morpholinopropiophenone 5-10%,..., 55G/UNA | XXXXXXXXXX | 44 | KGM | 11220 | China | NA |
| 3/30/2024 | 35061000 | AB Epoxy glue, 2 components. 100% new item#&TW | XXXXXXXXXX | 10 | SET | 20.317 | VIETNAM | NA |
| 3/30/2024 | 35061000 | RAC35137301#&EPOXY GLUE HT-20000S-B(L)-5 material Bisphenol F Diglycidyl Ether 65-75%, Fumed Silica 3-9%) used to glue electronic components-IVIDIV(RAC35137301).100% new | XXXXXXXXXX | 3600 | GRM | 3751.92 | South Korea | NA |