3/30/2024 | 38101000 | NW266#&Cream solder tin (lead-free SAC305 INDIUM8.9HF; material: 1.Tin (Sn) 80.1-88.8%;2.Silver (Ag) 2.5-2.8%;3.Copper (Cu) 0.42- 0.46%;...;),911-0R10-023 | XXXXXXXXXX | 50 | KGM | 5950 | Singapore | NA |
3/30/2024 | 38101000 | K10010000203#&Senju S70G solder paste (K10010000203) (500g/bottle), TP: tin 80-90%, copper <1%, silver 1-3%, rosin 4-6%, used for soldering in electronics production. 100% new product #&CN | XXXXXXXXXX | 50000 | GRM | 4265 | China | NA |
3/30/2024 | 38101000 | GTM-7000#&Solder paste FS-808A (500g/box) (Tin paste, 86.5% tin content). 100% new product (SAP code: 700035910) | XXXXXXXXXX | 20 | KGM | 1584.722 | China | NA |
3/29/2024 | 38101000 | .#&ECO SOLDER PASTE S70G-HF TYPE4 soldering paste (H130410009038), 500G/JAR, 500G/BOT, TP: tin 80-90%, copper <1%, silver 1-3%, rosin 4-6%, used for soldering in electronics manufacturing. New 100% | XXXXXXXXXX | 131500 | GRM | 12558.25 | China | NA |
3/29/2024 | 38101000 | LXVTC35#&ALPHA OM550 HRL1 cream solder tin, 500g/bottle (CAS TP: 7440-69-9,7440-31-5,144413-22-9,65997-06-0,112-59-4) 230-200020-550RH .new 100% | XXXXXXXXXX | 30000 | GRM | 3237 | Hong Kong | NA |
3/29/2024 | 38101000 | 322000500285 - Solder paste (Solder paste 154851), 90G/PCS; Main ingredients: TIN (CAS: 7440-31-5) 70-80%, . 100% new#&CN | XXXXXXXXXX | 630 | GRM | 361.368 | VIETNAM | NA |
3/29/2024 | 38101000 | Solder paste SN63/Pd37, ingredients: lead 37%, tin Sn: 63%, used to solder materials. 100% new#&CN | XXXXXXXXXX | 400 | GRM | 45.52 | China | NA |
3/29/2024 | 38101000 | ECO SOLDER PASTE S70G-HF TYPE4 soldering paste (H130410009038), 500G/JAR, 500G/ BOTTLE, TP: tin 80-90%, copper <1%, silver 1-3%, rosin 4-6%, used for soldering in electronics manufacturing. 100% new product #&CN | XXXXXXXXXX | 131500 | GRM | 12558.25 | VIETNAM | NA |
3/29/2024 | 38101000 | Tin paste (solder paste) in cream form, used to solder components for electronic assembly production, model GM2-910-VH. New 100% | XXXXXXXXXX | 100 | KGM | 3695 | China | NA |
3/29/2024 | 38101000 | SOLDER PASTE S3X811-NT2 solder paste (250G), TP: Tin(75-80%); Silver(2-3%); Rosin, oligomers (2-4%), (1 box/250G). New 100%. | XXXXXXXXXX | 2 | UNK | 440 | Japan | NA |